Chip-to-chip communications
CHIP-TO-CHIP COMMUNICATIONS 专利名称：CHIP-TO-CHIP COMMUNICATIONS 发明人：Ian Swarbrick,Joseph Jun Cao 申请号：US13752050 申请日：20130128 公开号：US20130195210A1 公开日：20130801 专利内容由知识产权出版社提供 专利附图：摘要：Devices and systems are described for transmitting data packets over a chip-...
CHIP-TO-CHIP COMMUNICATIONS USING SUB-MILLIMETER WAVES AND DIELECTRIC WAVEGUIDECHIP-TO-CHIP COMMUNICATIONS USING SUB-MILLIMETER WAVES AND DIELECTRIC WAVEGUIDEA system 300-1 provides a "wireless" interconnect system between ICs 302-1 and 304-1 using a dielectric waveguide 316. Each of ICs 302-1 and...
Method and system for chip-to-chip communications with wireline control Aspects of a method and system for chip-to-chip communications with wireline control may include initializing a microwave communication link between a firs... 阿玛德雷兹·罗弗戈兰 被引量: 0发表: 2008年 System and method to ...
Aspects of a method and system for transmit diversity for chip-to-chip communications may include transmitting a plurality of signals generated in accordance with a transmission diversity protocol via a plurality of transmit antennas integrated in/on a first chip. The plurality of signals may be ...
Free-space optics can help alleviate the communications problems of electronic computers by its large spatial and temporal bandwidth. For compact packaging, the concept of planar-integrated free-space optics is used. Here, we give an overview of the design, fabrication and thermal management of plan...
An inductive-coupling ThruChip Interface (TCI) is applied to stacked-chip communications, forming a low-cost and robust high-speed 3D NoC. A prototype ... H Nakamura - IEEE 被引量: 8发表: 2013年 Inductive coupling transceivers for inter-chip data communication ThruChip Interface (TCI) employi...
25, 2014, naming Roger Ulrich, entitled “Multilevel Driver Circuit for High Speed Chip-to-Chip Communications,” which is hereby incorporated herein by reference in its entirety for all purposes. The following references are herein incorporated by reference in their entirety for all purposes: U....
- 《IEEE Transactions on Communications》 被引量: 16发表: 2006年 Equalizing filter design for high-speed off-chip buses. On-chip speeds and integration densities have grown exponentially over the past several decades creating a corresponding demand for high-bandwidth, chip-to-chip communication. ...
We have developed a novel current mode multi-level simultaneous bidirectional I/O scheme for high throughput chip-to-chip communications. Data are represented by multi-level currents on the transmission line instead of multi-level voltages. The current mode scheme consumes less power and is faster ...