Chip-to-ChipandOn-ChipCommunications-InTech 系统标签: chipintechcommunicationsinterconnectsmezghanirusser 1.IntroductionInhigh-performanceintegratedcircuitsmanufacturedinCMOSdeepsub-microntechnology,thespeedofglobalinformationexchangeonthechiphasdevelopedintoabottleneck,thatlimitstheeffectiveinformationprocessingspeed.Thisisca...
Devices and systems are described for transmitting data packets over a chip-to-chip communications link. For example, a device includes a hardware replay buffer to store a data packet. The data packet includes an overhead portion and a payload portion. Additionally, the transmitter device includes...
Using this receiver, 3Gb/s chip-to-chip communication is demons... L Lei,JM Wilson,SE Mick,... - IEEE Journal of Solid-State Circuits 被引量: 131发表: 2006年 An On-Chip and Inter-Chip Communications Network for the SpiNNaker Massively-Parallel Neural Net Simulator The real-time modelling...
CHIP-TO-CHIP COMMUNICATIONS 专利名称：CHIP-TO-CHIP COMMUNICATIONS 发明人：Ian Swarbrick,Joseph Jun Cao 申请号：US13752050 申请日：20130128 公开号：US20130195210A1 公开日：20130801 专利内容由知识产权出版社提供 专利附图：摘要：Devices and systems are described for transmitting data packets over a chip-...
An inductive-coupling ThruChip Interface (TCI) is applied to stacked-chip communications, forming a low-cost and robust high-speed 3D NoC. A prototype ... H Nakamura - IEEE 被引量: 8发表: 2013年 Inductive coupling transceivers for inter-chip data communication ThruChip Interface (TCI) employi...
CHIP-TO-CHIP COMMUNICATIONS USING SUB-MILLIMETER WAVES AND DIELECTRIC WAVEGUIDECHIP-TO-CHIP COMMUNICATIONS USING SUB-MILLIMETER WAVES AND DIELECTRIC WAVEGUIDEA system 300-1 provides a "wireless" interconnect system between ICs 302-1 and 304-1 using a dielectric waveguide 316. Each of ICs 302-1 and...
Methods and Systems for High Bandwidth Chip-to-Chip Communications InterfaceMethods and Systems for High Bandwidth Chip-to-Chip Communications InterfaceSystems and methods are described for transmitting data over physical channels to provide a high bandwidth, low latency interface between integrated circuit...
This work reviews hardware implementations of neural networks, with an emphasis on analogue implementations, and proposes a new method for overcoming connectivity constraints, by the use of Frequency Division Multiplexing (FDM) for the inter-chip communications. In this FDM scheme, multiple analogue ...
(denoted as PEDOT:PSS:AgNWs) was spin-coated on the glass wafer and then patterned as transparent bottom electrode arrays that cover the finger-shaped mesa structures. To assist the pattern transfer process, a silver protecting layer (200 nm) was deposited on the PEDOT:PSS:AgNWs polymer ...
Aspects of a method and system for transmit diversity for chip-to-chip communications may include transmitting a plurality of signals generated in accordance with a transmission diversity protocol via a plurality of transmit antennas integrated in/on a first chip. The plurality of signals may be ...