The stacked on lower carrier layer in seed layer upper layer. Dry film is laminated in the seed layer of compression and solder surface. The dry film is formed in Cu columns, is exposed to light to expose seed layer. The exposed seed layer is plated. Compressive surfaces are polished. It...
The electric-optical circuit carrier provided in the form of a printed circuit board comprises at least one light-conductive layer (30) between light impermeable layers (12;21), whereby optical components (5) are arranged on the top side... WIGGERMANN, UDO 被引量: ...
Shenzhen Safe de Technology Co., Ltd is a professional IC carrier PCB, high-precision multi-layer multi-level HDI, any interconnected HDI, high-precision multi-layer multi-level module half-hole HDI, high-precision multi-layer through-hole PCB, soft Hard
metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacity, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED,...
PCB carrier and carrier tape used for small-size molding-package cardThe utility model discloses a PCB carrier and a carrier tape used for a small-size molding-package card. The carrier is formed through successive overlapping of a top printing ink layer, an upper copper-clad foil layer, a...
The development of packaging technology drives the development of carrier boards. The FC process has become mainstream, and multi-chip 3D packaging and large-size high-density multi-layer substrates are the current development direction. In order to improve performance, reduce power consumption, and ...
The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures con... WT Lin,CH Chien,FY Chen 被引量: 0发表: 2021年 ANTENNA CARRIER COMPRISING FLEXIBLE CIRCUIT BOARD The present invention relates to an antenna carrier, comprising a...
A semi-flex component carrier includes a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion. The at least one electrically insulating layer...
Layer 1-60 Layers Service Turnkey Assembly PCB Service Other Capabilities Repair/Rework Services Mechanical Assembly Box Bui Min Hole Size Mechanical Hole: 0.15mm, Laser Hole: 0.1mm Outline Profile Rout/ V-Cut/ Bridge/ ...
Judging from the product form, the main ones that will benefit from this trend are high-level multi-layer hard boards and high density interconnect (HDI) boards. Because high multi-layer boards can support more complex communication capabilities and server data processing capabilities, demand will ...