网络后道工序;后段制程;低介电常数材料在后端工序 网络释义
[3]这部分工艺流程是为了在Si衬底上实现N型和P型场效应晶体管,又被称为前道(front end of line,FEOL)工艺。与之相对应的是后道(backend of line,BEOL)工艺,后道实际上就是建立若干层的导电金属线,不同层金属线之间由柱状金属相连。目前大多选用Cu作为导电金属,因此后道又被称为Cu互联(interconnect)。这些...
在集成电路制造中,前道工艺(FEOL, Front End of Line)和后道工艺(BEOL, Back End of Line)是两个密切相关、但工艺内容和目标完全不同的阶段。要理解它们的区别,可以将整个半导体制造过程比喻为建造一座智能大厦:前道工艺相当于“建设基础与结构框架”,而后道工艺则是“完成内部连线与功能集成”。 一、前道工艺...
从寄生电阻和电容、电迁移两方面说明后道工艺中(Back-End-Of-Line,BEOL)采用铜(Cu)互连和低介电常数(low-k)材料的必要性。相关知识点: 试题来源: 解析 寄生电阻和寄生电容造成的延迟。电子在导电过程中会撞击导体中的离子,将动量转移给离子从而推动离子发生缓慢移动。该现象称为电迁移。在导电过程中,电迁移不...
Back end of line Back end of line The back end of line(BEOL)is the second portion of IC fabrication where the individual devices(transistors,ca-pacitors,resistors,etc.)get interconnected with wiring on the wafer.[1]BEOL generally begins when thefirst layer of metal is deposited on the ...
This paper reports the characterization of poly-silicon-germanium disk resonators at frequencies ranging from 35 to 425MHz. The back-end-of-line process technology is based on Spacer definition of sub-100nm lateral gaps, and uses Aluminum as interconnect material for compatibility with advanced CMOS...
Theback end of line (BEOL)is the final state semiconductor processing that concerns the interconnects that reside in the top part of a chip. In today's advanced IC's, that consists of up to fifteen layers of complex wiring. As device scaling continues to 3 nm and beyond, the interconnects...
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By the end of the first chapter, requests were coming from thebackseat: "Please read a little louder." 2016年高考英语四川卷 完形填空 原文 By year three, the rabbits and the groundhog wereback. 2015年高考英语四川卷 完形填空 原文 Captain Scott had reached the south pole early in 1912 but ...