实际上B200相比H100，真正单个DIE的性能提升在2~3倍左右。即便如此，AI芯片的发展已经超过摩尔定律，这是...
The die size of Blackwell platform chips like the B100 is twice that of the H100. As Blackwell becomes mainstream in 2025, the total capacity of TSMC's CoWoS is projected to grow by 150% in 2024 and by over 70% in 2025, with NVIDIA's demand occupying nearly half of this capacity. Fo...
B200 相对于 B100 在算力方面可谓全面提升，但是并不是理想状态下 two-die 呈倍数的提升，这里其实你也...
The trend in GPU roadmaps is more silicon (for both logic and memory) in a bigger package and silicon-based interposers are hitting their limit in terms of size. The increased size makes silicon much harder to handle which kills yields. The B100 package is much larger, and as such it ...
While they are not disclosing the size of the individual dies, we’re told that they are “reticle-sized” dies, which should put them somewhere over 800mm2 each. The GH100 die itself was already approaching TSMC’s 4nm reticle limits, so there’s very little room for ...
When running inference on smaller models on a single GPU, you generally end up with a curve like the below which shows very high interactivity (tokens/second/user) at low batch sizes, and as you increase batch size, throughput grows, but interactivity also comes down. There is a tradeoff ...
If the drive being replaced was part of a RAID array we recommend using a newly ordered drive of identical size, model, and manufacturer to replace the failed drive. Cisco recommends following industry standard practice of using drives of the same capacity when creating RAID volumes. If drives ...
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SNR performance of all ADCs, especially high speed ADCs, is sensitive to the amount of capacitance at the data outputs because the currents required of the ADC data outputs to charge and discharge these capacitances cause voltage spikes (noise) on the die. Minimizing the output capacitance will...