The eutectic alloys of InSb-MSb where M is a metal of Mn, Ni, Fe, and Cr, have been directionally solidified at various rates of solidification in order to investigate the structure change due to the solidification condition, and the boundary energy between InSb and MSb phases was determined...
The resulting proposed Au Sn phase diagram contains six intermetallic compounds and seven invariant reactions.Within the gold-rich region of the diagram there are four invariant reactions that occur: peritectics at 532 and 521 °C, a eutectic at 280 °C and a peritectoid at 190 °C, below ...
The bonded samples had electroplated Au-Sn layers, with an overall composition of 8 wt% Sn (13 at% Sn), thus being a surplus of Au relative to the eutectic point. The Sn layer was converted to an intermetallic compound prior to bonding. No flux agent or chemical surface treatment was ...
无氰共沉积Au.Sn电镀液稳定性研究 StudyontheStabilityofaNon-CyanideAu-SnCo—electrodepositionPlatingSolutionAbstractAu-30at.%Sneutecticalloyiswidelyusedinelectronicpackagingindustryassoldermaterialforitsexcellentmechanicalproperties,outstandingthermalconductivity,andcanbeusedwithoutflux.Thehighmeltingpoint,excellentcreepres...
The Au–Ge phase diagram is a binary eutectic system without any intermetallic compounds. The Au–Ge binary system was previously optimized by Chevalier [13] and later by Wang et al. [14]. Both assessments reproduce well most of the experimental information on phase diagram and thermodynamic pro...
goldantimonyalloyThe heat content of the solid and liquid Au-Sb goldrich eutectic alloy was measured from 298K to T (461-846K) on heating (drop ... A Yassin,R Castanet - 《High Temperature Materials & Processes》 被引量: 4发表: 1997年 Au-Sb and Au-Ag-Sb alloys as low-voltage conta...
1.2.4 机械性能1.2.4.1 拉伸强度Sn-Ag共晶合金的抗拉强度与共晶Sn-Pb相当或更 9、高(表1),比共晶Sn-Bi略低。经拉伸变形之后, -Sn枝晶破碎,并且外加荷呈45的取向排列4。表1-1 共晶Sn-Ag和Sn-Pb合金的抗拉强度Table1-1 the tensile strength of eutectic Sn-Ag and Sn-Pb alloy应变速度(S-1)工艺Sn-...
1.2.4 机械性能 1.2.4.1 拉伸强度 Sn-Ag共晶合金的抗拉强度与共晶Sn-Pb相当或更高(表1),比共晶Sn-Bi略低。经拉伸变形之后, β-Sn枝晶破碎,并且外加荷呈45°的取向排列[4]。表1-1 共晶Sn-Ag和Sn-Pb合金的抗拉强度 Table1-1 the tensile strength of eutectic Sn-Ag and Sn-Pb alloy 应变速度(S-1...
an Au—Sn—Bi alloy thin film which has the thickness of 5 μm or less and includes at least a eutectic structure can be formed by using an Au—Sn—Bi alloy powder paste that mixes the Au—Sn alloy powder containing 20 wt % to 25 wt % of Sn, 0.1 wt % to 5.0 wt % of Bi, ...
It is shown that unlike Au GaAs Schottky diodes, a Schottky barrier made on GaAs using an evaporated film of Au Ga eutectic alloy does not degrade on hea... S Guha,BM Arora,VP Salvi - 《Solid State Electronics》 被引量: 45发表: 1977年 ...