For all the SDK examples The linker command is updated to include theFLASHmemory segment. The code/rodata section are NOT re-directed to FLASH by default though, unless mentioned otherwise in the example. XIP post-build steps are always invoked as part of application post build. Invoking these...
MDIO link change status callback (API) for application is disabled. Polling logic to get LINK status of active PHYs should be implemented by application, by callingEnetPhy_isLinked()API from PHY driver. Please refer to "Enet Lwip CPSW Example" and "Enet Lwip ICSSG Example" for implementation...
在Windows PowerShell终端执行如下命令,基于xxx.out文件使用CCS和MCU+ SDK生成xxx.rprc文件,xxx.rprc文件已包含可加载段的bin文件。CCS与MCU+ SDK路径请以实际情况为准。 Window#C:\ti\ccs1120\ccs/tools/node/node C:/ti/mcu_plus_sdk_am64x_08_03_00_18/tools/boot/out2rprc/elf2rprc.js led_flash...
CCS与MCU+ SDK路径请以实际情况为准。 Window#C:\ti\ccs1120\ccs/tools/node/node C:/ti/mcu_plus_sdk_am64x_08_03_00_18/tools/boot/out2rprc/elf2rprc.js led_flash_a53ss_nortos.out Window#C:\ti\ccs1120\ccs/tools/node/node C:/ti/mcu_plus_sdk_am64x_08_03_00_18/tools/boot/out...
进入MCU+ SDK组件安装目录"C:\ti\mcu_plus_sdk_am64x_08_03_00_18\tools\boot\sbl_prebuilt\am64x-evm\",将sbl_sd.release.tiimage拷贝至Micro SD卡,并重命名为tiboot3.bin,如下图所示。 备注:sbl_sd.release.tiimage为官方提供的SBL镜像。
2. Will the new version in 08.06 version is a production ready stack? Existing Plan: 08.06 version stack will be with Profinet RT functionality but requires external DDR. Is an alpha release, not meant for production. And won't be part of public SDK. ...
进入MCU+ SDK组件安装目录"C:\ti\mcu_plus_sdk_am64x_08_03_00_18\tools\boot\sbl_prebuilt\am64x-evm\",将sbl_sd.release.tiimage拷贝至Micro SD卡,并重命名为tiboot3.bin,如下图所示。 备注:sbl_sd.release.tiimage为官方提供的SBL镜像。
MCU+ SDK:mcu_plus_sdk_am64x_08_03_00_18 SysConfig:sysconfig-1.12.1_2446 GCC AARCH64 Compiler:gcc-arm-9.2-2019.12-mingw-w64-i686-aarch64-none-elf FreeRTOS案例位于“4-软件资料\Demo\RTOS-demos\”目录下,Baremetal案例位于“4-软件资料\Demo\Baremetal-demos\”目录下。案例project目录分别存放Co...
7核的AM64x处理器(具体应该是AM6442)、2GB LPDDR2、16MB OSPI、一个microSD卡槽、一个双频Wi-Fi*蓝牙5.1模块(WiLink 8 WL1837MOD)、两个RJ-45千兆以太网端口、一个 USB 3.1端口、一个用于串行的微型 USB 端口(3x UART)、一个 JTAG 仿真器、一个40针树莓派扩展接头以及 PRU、实时 I/O 和 TI-MCU ...
MCU+ SDK:mcu_plus_sdk_am64x_08_03_00_18 SysConfig:sysconfig-1.12.1_2446 GCC AARCH64 Compiler:gcc-arm-9.2-2019.12-mingw-w64-i686-aarch64-none-elf 本文测试板卡为创龙科技TL64x-EVM,它是一款基于TI Sitara系列AM64x双核ARM Cortex-A53 + 单/四核Cortex-R5F + 单核Cortex-M4F多核处理器设计的...