以下是AEC-Q100-001Rev-C中所包含的更改的摘要细节:➢第1.3.4.4节，类型-4芯片表面接触：修正后的措辞，以反映剪切工具接触芯片表面时的粘接剪切类型，而不是版本B中规定的粘接表面。➢增加了新的第1.3.5节，足迹：增加了“足迹”的新定义；更改了后续章节的数量，以反映所添加的内容。➢第3.6节b步...
AEC - Q100-001 - REV-C October 8, 1998 Automotive Electronics Council Component Technical Committee ATTACHMENT 1 AEC - Q100-001 REV-C WIRE BOND SHEAR TEST AEC - Q100-001 - REV-C October 8, 1998 Automotive Electronics Council Component Technical Committee Acknowledgment Any document involving a ...
AEC - Q100-001 - REV-C October 8, 1998Automotive Electronics Council Component Technical CommitteeATTACHMENT 1 AEC - Q100-001 REV-C WIRE BOND SHEAR TESTAEC - Q100-001 - REV-C October 8, 1998Automotive Electronics Council Component Technical Committee...
Pb-Free Test Requirements1.6 AEC-Q006 : Qualification Requirements for Components using Copper (Cu) Wire Interconnects2 AEC-Q100 : Failure Mechanism Based Stress Test Qualification For Integrated Circuits2.1 AEC - Q100-001: Wire Bond Shear Test2.2 AEC - Q100-002: Human Body Model (HBM) Electrosta...
1. 键合金球剪切测试(WBS) 1.1 测试信息 样品数量: 30个键合线测试,共5个器件 参考方法:AEC-Q100-001-Rev-C 测试确认:不适用(无需做芯片功能/性能测试) 测试点:每个器件选取6个键合线 合格判据:开封后测试, 按照PPAP,要求大于多少g(由客户确认) ...
AEC-Q100、AEC-Q101、AEC-Q102、AEC-Q104、AEC-Q200认证标准主要如下: AEC-Q001 零件平均测试指导原则 AEC-Q002 统计式良品率分析的指导原则 AEC-Q003 芯片产品的电性表现特性化的指导原则 JEDEC JESD-22 封装器件可靠性测试方法 MIL-STD-883 微电子测试方式和程序 ...
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