GUIDELINE FOR CHARACTERIZATION OF INTEGRATED CIRCUITS AEC - Q003 July 31, 2001Component Technical CommitteeAutomotive Electronics CouncilUpper SpecLower SpecProcessWindow Device Parameter (at one test temperature)FrequencyBetaBase Rs (ohms /sq)Matrix CellTest LimitEach dot is ameasurementfrom one partGuar...
AEC_Q003 AEC - Q003 July 31, 2001 Component Technical Committee Automotive Electronics Council
AEC - Q003 Rev - 集成电路产品电气性能鉴定指南Guidelines for Characterizing the Electrical Performance of Integrate.pdf,AEC - Q003 July 31, 2001 ) Process q s Window / s Matrix Cell m h o ( s R e s a B Beta Lower Upper Spec Spec y c n e u q e r F Device P
AEC – Q003 July 31, 2001 Component Technical Committee Automotive Electronics Council 2 of 11 Figure 1 Schmoo Plot 3.3 Criteria For Characterization A device that meets the following criteria should be considered a candidate for characterization. ...
sample size要考虑到confidence interval:置信区间和confidence level:置信水平,这两个是统计用语,sample size的确认要考虑到这两个参数的要求吗? 4.3 Characterization Report The characterization report should include the following: 特征参数报告应该包括:
Automotive Electronics Council Component Technical Committee AEC - Q003 Rev-A February 18, 2013 GUIDELINE FOR CHARACTERIZATION OF INTEGRATED CIRCUITS Automotive Electronics Council Component Technical Committee AEC - Q003 Rev-A February 18, 2013 Acknowledgment Any document involving a complex technology ...
AEC-Q003 芯片产品的电性能表现特性的指导原则 AEC-Q004 零缺陷指导原则(草稿) AEC-Q005 无铅需求 SAE J1752/3 集成电路辐射测量流程 编者注:上面5个AEC-Q文件,并非Q100的附件,而是AEC认证的附件,需要单独在官网下载。 1.2.2 军工等级标准 MIL-STD-883 微电子测试方法和流程 ...
AEC-Q102-003中定义的OE-MCMs是由至少包含一种光电器件的多个有源或无源器件组成,这些子组件通过焊接或胶粘方式相互连接到线路板上构成复杂电路封装在单个多芯片模组内。构成模组内的子组件可以是封装(例如塑封)和/或者未封装(例如裸芯)的形态。从标准规范、测试认证、商业和维护的角度考虑,多芯片模组在认证上是不...
AEC-Q102-003中定义的OE-MCMs是由至少包含一种光电器件的多个有源或无源器件组成,这些子组件通过焊接或胶粘方式相互连接到线路板上构成复杂电路封装在单个多芯片模组内。构成模组内的子组件可以是封装(例如塑封)和/或者未封装(例如裸芯)的形态。从标准规范、测试认证、商业和维护的角度考虑,多芯片模组在认证上是不...
AEC-Q102-003中定义的OE-MCMs是由至少包含一种光电器件的多个有源或无源器件组成,这些子组件通过焊接或胶粘方式相互连接到线路板上构成复杂电路封装在单个多芯片模组内。构成模组内的子组件可以是封装(例如塑封)和/或者未封装(例如裸芯)的形态。从标准规范、测试认证、商业和维护的角度考虑,多芯片模组在认证上是不...