electroless platingmetallisationThe use of laser doping in solar cell fabrication has received increased attention in recent years, especially due to its ability to form a selective emitter without subjecting the wafer to prolonged high temperature processes and likely corresponding degradation. At the ...
Disadvantages: higher cost, poor welding strength, because the electroless nickel plating process is used, it is easy to have the problem of black disk. The nickel layer will oxidize over time, and long-term reliability is a problem. Now we know that gold is gold and silver is silver? Of...
Sulfamate nickel plating uses a 99.9% pure nickel deposit rather than the traditional nickel sulfate used in electroless nickel plating. Because this is a much higher concentration of nickel it lends added advantages to the surface durability. Common...
DPC ceramicsare also called direct copper-plated substrates. Firstly, according to the product requirements and planning requirements, theceramic substrateis drilled, scribed, etc. after laser cleaning, and then vacuum plating is used to plate copper on the ceramic substrate, followed by yellow litho...
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) ENEPIG, a relative newcomer to the circuit board world of finishes, first came on the market in the late 90s. This three-layer metallic coating of nickel, palladium, and gold provides an option like no others: it is bondable. ENE...
surface deposition processes,first sputtering titanium,chromium,then copper particles under vacuum conditions,and finally electroplating Increase the thickness,then complete the circuit production by ordinary PCB technology,and finally increase the thickness of the circuit by electroplating/electroless plating. ...
Disadvantages: high cost, poor welding strength, because the electroless nickel plating process is used, it is easy to have the problem of black disk. The nickel layer oxidizes over time, and long-term reliability is an issue. The immersion gold process is different from the OSP process. It...