hybrid integrated circuitssemiconductor laserssilicon photonicssurface emitting laserssilicon laserA novel 3D hybrid integration platform combines group III-V materials and silicon photonics to yield high-performance lasers is presented. This platform is based on flip-chip bonding and vertical optical ...
All rights reserved 2047-7538/14 www.nature.com/lsa Hybrid 2D–3D optical devices for integrated optics by direct laser writing Martin Schumann1,2, Tiemo Bu¨ckmann1, Nico Gruhler2, Martin Wegener1,2 and Wolfram Pernice2 Integrated optical chips have already been established for application ...
silicon device structures and their subsequent scaling in size and performance. Yet, advanced scaling requires ultrathin semiconducting channels, which are difficult to achieve using silicon. In this context, field-effect transistors based on two-dimensional (2D) semiconductors have drawn notable ...
展开 关键词: power management Dark silicon Non-Volatile Memory (NVM Hybrid memory Architecture Embedded chip-multiprocessor (eCMP Convex-optimization 会议名称: IEEE International Symposium on Circuits & Systems 会议时间: 11 August 2016 主办单位: IEEE 收藏...
實際上,熔融鍵合技術已經被大量使用在某些應用當中,包括圖像傳感器和特殊基板,例如矽-絕緣體(silicon- on-insulator,SOI)晶圓。而晶圓與晶圓間熔融鍵合的作法其實可以很容易地被導入採用low-k介電質和標準金屬的CMOS製程。 定位是3D-IC熔接技術的關鍵 對via-last鍵合法而言,縮小通孔尺寸是成本降低的關鍵。而對混合...
High-Performance On-Chip Hybrid Supercapacitors Poly(3,4-(ethylenedioxy)thiophene)-Coated Diamond/Silicon Nanowire Electrodes 3D Multihierarchical Heteronanostructures high-energy advanced on-chip supercapacitor supercapacitor devices Aprotic Ionic Liquid 引用走势 2017 被引量:4 0...
据透露,使用“混合结合(Hybrid bonding)”技术的测试芯片已在2020年第二季度流片。而其实在之前,英特尔也在2.5D上有了尝试,那就是他们的EMIB。 EMIB的全称是“Embedded Multi-Die Interconnect Bridge”。因为没有引入额外的硅中介层,而是只在两枚裸片边缘连接处加入了一条硅桥接层(Silicon Bridge),并重新定制化...
3D stack testing through functional interface, TSMC is working with Synopsys and ATE partners on a silicon demonstrator to achieve the goal of 10x testing productivity boost. The Company is also working with all design-for-test (DFT) EDA partners to ensure effective and efficient interface tes...
5and silicon-integrated photodetectors6,7. Graphene-based modulators have already proven broadband optical bandwidth1, high speed8,9, relatively high modulation efficiencies10, and temperature stability8. These devices are all based on complementary metal–oxide–semiconductor (CMOS)-compatible material7,...
Furthermore, we experimentally demonstrate a stereolithography-inspired proof-of-concept version of the chip-based 3D printer using a visible-light beam-steering integrated optical phased array and visible-light-curable resin, showing 3D printing using a chip-based system for the first time. This ...