x 各位高手，DRC 检测后出现warning :zero hole size multi-layerpadsdetected：- r4 I: J2 R4 f9 ...
zero hole size multi-layerpadsdetected：* {3 U* p/ q. W$ p* C pad free-1 (坐标) ...
The electromigration induced failure and degradation of joint strength are common in Cu based bond pads. This could be prevented by using Co as a metal bond. For the solder/Ni-20 at.% Co substrate combination, the (Nix,Cuy,Co1 − x − y)Sn2 intermetallic compound layer formed early,...
x 各位高手，DRC 检测后出现warning :zero hole size multi-layerpadsdetected：( e: O: m2 r: L)...