(PL)V CCINT /V CCBRAM = 0.95V and are screened for lower maximum static power. The speed specification of a -2LI device is the same as that of a -2 device. The -1LQ devices operate at the same voltage and speed as the -1Q devices and are screened for lower power. Zynq-7000 ...
FPGA可编程逻辑器件芯⽚XC7Z045-2FFG900C-XC7Z045-2FFG900I规格书Introduction Overview The ZC706 evaluation kit is based on the Zynq?-7000 XC7Z045-2FFG900C SoC. For additional information, see the Zynq-7000 SoC Overview datasheet (DS190) [Ref1].A built-in self-test (BIST) and a PCIe?
FPGA可编程逻辑器件芯片XC7Z045-2FFG900C-XC7Z045-2FFG900I规格书.pdf,FPGA可可编编程程逻逻辑辑器器件件芯芯⽚⽚XC7Z045-2FFG900C-XC7Z045-2FFG900I规规格格书书 Introduction Overview The ZC706 evaluation kit is based on the Zynq?-7000 XC7Z0 5-2FFG900C SoC. Fo
<br/>DS191(v1.18.1)July2,2018<br/>ProductSpecification<br/>Introduction<br/>TheZynq®-7000SoCsareavailablein-3,-2,-2LI,-1,and<br/>-1LQspeedgrades,with-3havingthehighe..
FCBGA-900 6周 在产 2009年 ¥530.631 数据手册(12) 器件3D模型 规格参数 代替型号 (5) 反馈错误 by FindIC.com 价格库存 规格参数 数据手册 代替型号 XC7Z045-2FFG900I 全球供应商 全球供应商 (2家) 刷新货币单位: 需求数量: -+ 含%增值税 ...
L1缓存指令存储器 2 x 32 kB L1缓存数据存储器 2 x 32 kB 逻辑元件数量 350000 LE 输入/输出端数量 362 I/O 最小工作温度 - 40 C 最大工作温度 + 100 C 湿度敏感性 Yes 逻辑数组块数量——LAB 27325 LAB 系列 XC7Z045 可售卖地 全国 型号 XC7Z045-L2FFG900I PDF资料 集成电路-其...
In Chapter 2: Updated links in Table 2-1.In Chapter 4: In response to XCN16004: Forged to Stamped Lid Conversion for Monolithic FPGA Flip Chip Packages, added Figure 4-13: FFG900 (XC7Z035, XC7Z045, and XC7Z100) Flip-Chip BGA with Stamped Lid Package Specifications .06/14/2017 1.7...
XC7Z045-2FFG900I
封装/ 箱体: FBGA-900 核心: ARM Cortex A9 内核数量: 2 Core 最大时钟频率: 667 MHz L1缓存指令存储器: 2 x 32 kB L1缓存数据存储器: 2 x 32 kB 逻辑元件数量: 350000 LE 输入/输出端数量: 362 I/O 最小工作温度: - 40 C 最大工作温度: + 100 C 湿度敏感性: Yes 逻辑...
XC7Z045-2FFG900I是一款基于FPGA（现场可编程门阵列）的芯片，由Xilinx公司生产。该芯片具有高度灵活性和可编程性，能够适应各种应用场景，如通信、图像处理、工业控制等。首先，XC7Z045-2FFG900I采用了先进的28纳米工艺，具有低功耗、高速度和低成本等优点。其核心是一个Zynq 7000系列FPGA，由高性能的ARM Cortex-A9...