Said first MEMS chip is acoustically coupled to the first opening. Said second MEMS chip is acoustically coupled to the second opening.PAHL, WolfgangFEIERTAG, Gregor
In notches (ES1) guided in the MEMS wafer and, as needed, the base wafer for separating the components, a shielding metalization (SD) is produced in an integrated method. The connection contacts (AK) of the package are subsequently produced on the lower face of the base wafer.FEIERTAG, ...
The present invention related to a novel diastereoselective proces for preparing β- D - and β- L -2' , 3' -dideoxy nucleoside analogs and to intermediates useful in this process.Albert, MartinDe Souza, DominicFeiertag, PetraHönig, Helmut...
The invention relates to a recyclable container (1) having an upper part (3) and a bottom part (2), which is in the form of a building block and to this end has male assembly means (15) and/or female assembly means (16) on a first side wall (4) and male assembly means (15) ...