Said first MEMS chip is acoustically coupled to the first opening. Said second MEMS chip is acoustically coupled to the second opening.PAHL, WolfgangFEIERTAG, Gregor
The connection contacts (AK) of the package are subsequently produced on the lower face of the base wafer.FEIERTAG, GregorKRÜGER, HansLEIDL, AntonPAHL, WolfgangPORTMANN, JürgenSTELZL, Alois
The invention relates to a recyclable container (1) having an upper part (3) and a bottom part (2), which is in the form of a building block and to this end has male assembly means (15) and/or female assembly means (16) on a first side wall (4) and male assembly means (15) ...
The present invention related to a novel diastereoselective proces for preparing β- D - and β- L -2' , 3' -dideoxy nucleoside analogs and to intermediates useful in this process.Albert, MartinDe Souza, DominicFeiertag, PetraHönig, Helmut...