封装 WLCSP 4-4 ball 数量 5000 RoHS 是 产品种类 电子元器件 最小工作温度 -20C 最大工作温度 90C 最小电源电压 4V 最大电源电压 6V 长度 8.9mm 宽度 8.7mm 高度 1.2mm 可售卖地 全国 型号 GD25LQ255ELEG 技术参数 品牌: GD/兆易创新 型号: GD25LQ255ELEG 封装: WLCSP 4-4 ball...
封装 WLCSP4ball 数量 500000 RoHS 是 产品种类 电子元器件 最小工作温度 -10C 最大工作温度 130C 最小电源电压 1V 最大电源电压 9V 长度 4.7mm 宽度 6.3mm 高度 2mm 可售卖地 全国 型号 P24C128E-D4H-MIR 深圳市钧敏科技有限公司专注于电机控制15年,始终秉承"开拓创新,务实高效"的企业...
WLCSP (3-2-3 ball array), -40℃~85℃, -40℃~105℃, -40℃~125℃ GD25LB256ENR1.8V256Mb166(x1 x4), 104(x4 DTR)DTR,Default 4I/O, H/W RESET,WP#, Secured OTPWSON8 6x5mm, WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array), ...
STMicroelectronics has extended its M24 serial EEPROM family with four new devices that are fully compatible with the industry-standard 4-ball WLCSP (Wafer Level Chip Scale Package) footprint. The new additions also enable, for the first time, to connect two or more 4-pin EEPROMs to the sam...
封装: WLCSP4ball 数量: 500000 RoHS: 是 产品种类: 电子元器件 最小工作温度: -30C 最大工作温度: 80C 最小电源电压: 1V 最大电源电压: 6V 长度: 4.6mm 宽度: 8.7mm 高度: 1.7mm 价格说明 价格:商品在平台的展示标价,具体的成交价格可能因商品参加活动等情况发生变化,也可能随着购买数...
data ◆ Same command/address signal with HyperRAM 2.0 CellularRAM vs HyperRAM Comparison Form Factor CellularRAM 64Mb WFBGA49: • 4mm * 4mm • Ball pitch 0.5mm HyperRAM WLCSP: Die/device level dimension • 256Mb: 30 ball <3mm*2.5mm • 64Mb: 15 ball <2mm*1.5mm Power @ Room ...
• Overmold process - The WLCSP component can be overmolded using processes that are consistent with typical overmold processes used in other plastic packages (i.e., Plastic Ball Grid Arrays, etc.). In evaluating the overmold process, it is recommended to consider the following factors: ...
(I/O) distribute within the chip surface, which is a kind of I/O Fan-in wafer level package, its core characteristics is to use redistribution layer technology to reconfigure the pad in the perimeter of the chip, and then finish the bumping formation (or solder ball). The chip area ...
3 x 3 array 0/180 0/180 3 x 4 array 0/231 0/231 表5. 晶片级1 级潮湿敏感度回流预处理测试数据(3 个批次) Moisture Sensitivity Level 1 Conditions Results 6 x 6 array 3x reflow passes, 260°C max 0/150 5 x 4 array 3x reflow passes, 260°C max 0/150 ...
WLCSP封装技术中的集成无源器件