thanks to the ultra-efficient 6 nm class SoC using the TSMC production process, which improves smart phone battery life. It also supports Wi-Fi 6E which is the latest standard that supports tri-band connectivity, while also providing simultaneous connectivity to both FR1 and FR2, with seamless ...
Advanced Modelling Processfor optimised chips Our specialAdvanced Modelling Processis part of our suite of in-house tools and flows and enables us to analyse exactly what is going on inside a chip design to ensure that the data flow is balanced properly and that the processors are not stalled ...
which is super-critical, and software. We use hardware platforms to drive verification, and that becomes even more critical in 3D-IC. It’s possible that you’re designing five chips, and one of them is in RTL and the other four are in silicon...
Intel's 10nm tech seems to be competitive with TSMC's 7nm tech, but the mobile first rollout brings up continued concerns with yields. Ice Lake has better integrated graphics (up to twice as fast as the previous generation), but right now there are only 2-core and 4-core solutions ...
This behaviour of these new designs using quite large amounts of power at these higher frequencies, however being seemingly similar power to TSMC’s process nodes at lower frequencies, points out to me that the 5LPE node has lower performance than TSMC’s N7P node. The fact that the Kirin...
TSMC's N7 process that AMD uses for RDNA2 (and RDNA and Zen 3 and the PS5/XSX) chips clearly delivers better performance and power characteristics than Samsung's custom 8N (really just an improved version of Samsung's 10LPP process). The catch being that lots of other companies also ...