US4308185 May 14, 1979 Dec 29, 1981 Scm Corporation Wherein the epoxy resin is graft polymerized to form an addition-condensation copolymer that is ionizable and dispersableUS4308185 * May 14, 1979 Dec 29, 1981 Scm Corporation Wherein the epoxy resin is graft polymerized to form an addition...
From labor shortages to challenging weather environments and more stringent building codes, the construction industry faces a wide variety of challenges simultaneously in its day-to-day operations. Read More July 25, 2022 Paints & Coatings, Automotive & Transportation Quiz: Epoxy Coatings & Additives...
Today, a concrete or epoxy matrix binder is used. Installers sprinkle extra chips on top while the material is still wet. Next, they cure the flooring, then grind and polish it. While you can buy terrazzo tiles, most often when people think about a terrazzo floor, it is the type that ...
A laminating and coating system is employed with a gravure or flexographic set up using an enclosed doctor blade system with recirculation to coat adhesive onto a film and then laminate it to another film. The preferred adhesive is a two-stage epoxy consisting of a zero VOC 100% solids lamina...
Epoxy resin, the epoxy resin constituent and the below-mentioned formula wherePROBLEM TO BE SOLVED: To provide an epoxy resin capable of obtaining a cured product having heat-resistance and high thermal conductivity, and an epoxy resin composition.植原 隆治...
The epoxy resin where fire-resistant epoxyPROBLEM TO BE SOLVED: To obtain a cured material having high flame-retardancy and excellent high-temperature reliability even without adding a bromine compound and an antimony compound.塩原 利夫
Epoxy resin composition where the glass transition temperature Tg of the cured material obtained by heating for 2 hours at 180 degrees C. is at least 150 degrees Cdoi:US20010003728 A1The outer peripheral portion 112 of said lattice walls 11 located in the vicinity of said peripheral wall 12 ...
The epoxy resin component and, 4,4 ' - diamino benzanilide (DABA) being the epoxy resin composition which includes with the cement powder which includes the particle, the epoxy resin composition where diameter of the DABA particle is under 100 microns, in addition, as for median grain size ...
PROBLEM TO BE SOLVED: To obtain a composition which contains very little or no brominated flame retardant or antimony compound, and is excellent in moldability, reliability and flame retardancy by blending essential constituents comprising an epoxy resin having a specified ICI viscosity, a curing ...
PROBLEM TO BE SOLVED: To obtain the subject composition excellent in preserving stability, flow property, forming property, reliability in moisture resistance and solder cracking resistance, and useful as a semiconductor sealing material by using a specific epoxy resin and a curing agent as ...