What difference between SMT (Surface Mount… Why do thinner PCBs will need carrier for reflow process? Red Dye Penetration Test to check for BGA solder… What is HIP/HoP? Uncovering the Causes of… Process,Quality,SMT,Test/InspectionWorkingBearViews (2,883)comment (0) AOI...
openings using a squeegee, ensuring accurate and consistent coverage. This process is crucial for the reflow soldering stage, where the paste melts to form strong solder joints. SMT stencils help improve manufacturing efficiency, reduce defects, and ensure high-quality assembly in electronics production...
The main component packaging type that can drive the use of HDI design and manufacturing in a PCB build is ball grid array (BGA) packaging, as well as related packaging types like land grid array (LGA). Many popular microcontrollers, MPUs, and FPGAs are offered in BGA packaging as this ...
In general, a PCB will have BGA components with several different pitches. Such as, there may be the BGA with 1.27mm pitch and 0.8mm pitch on a 4.0mm ( 160mil ) thick PCB. The minimum via hole is not only decided by drill hole, but also the aspect ratio, which is the ratio betwe...
BGA Package Pitch Fine pitch BGA packages ≤ 0.8mmSmall BGAs with pitch ≤ 0.5mm Lower density BGA packages with >1mm pitch Package Size Packages with high pin counts Larger package sizes above 15mm x 15mm Application Space Constraints Portable consumer electronics where space is critical - Process...
Steps Involved in Electronics Manufacturing Process Design The design is the first step in this process. In this step, engineers create a design and plan for the electronic device. It is important to consider the purpose of this device, the required components, and how to assemble the components...
Greentek Electronics is a printed circuit board manufacturer producing high quality, low cost barebones quickturn PCBs , prototype printed circuit boards and middle volume pcbs.
Embeddable BCI-ROM technology enables creation of accurate reduced order thermal models of IC Packages that can be used in 3D CFD electronics cooling simulation studies, including transient studies. The accuracy of an Embeddable BCI-ROM is close to a detailed thermal model and crucially, all interna...
A powerful example of materials characterization is the application of the field to electronics reliability. It is an area where measurement of material composition, microscopic structure, and physical properties are combined to assist engineers in developing electronics packages, from an Internet of Thing...
PCB Thickness: In backplanes, controlling thickness is difficult; thickness must increase to ensure matched impedance and signal integrity in these backplanes due to the need for controlled impedance transmission lines, power planes, and return paths. ...