A chiplet is a small, modular chip that performs a specific function very well. For example, a chiplet can be a processor core, a memory block, an I/O driver, or a signal processing unit. Chiplets are designed to be used in a chiplet-based architecture, in which multiple chiplets are...
Yet, AI design tools can reduce its carbon footprint by optimizing AI processor chips (as well as the workflows to design, verify, and test the chips) for better energy efficiency. AI Chip Design and Synopsys Synopsys is a pioneer in pervasive intelligence, the application of interconnected,...
Innovus Implementation System is optimized for the most challenging designs, as well as the latest FinFET 16nm, 14nm, 7nm, 5nm, and 3nm process nodes Integrity 3D-IC Platform for designing stacked-die ICs and chiplets for a variety of packaging styles (2.5D or 3D) Silicon Signoff and Ver...
This is leading chip designers to break up designs so that they can either be implemented on multiple physical chips or on ‘chiplets’, which are smaller chip dies that are combined with high-speed interfaces to form an efficient solution within a single package. This technique has been used...
Chiplet Design Memory Design PCIe Design SerDes Design Signal Integrity Power Integrity EP-Scan Design Cloud Learn more: Software: Keysight EDA for High Speed Digital Featured Resources Frequently Asked Questions (FAQs) Request a Free Trial
What are AI Chips? A Comprehensive Guide to AI Chip Design Synopsys Blog - Rob van Blommestein, Synopsys Aug. 11, 2023 There’s a lot of talk about AI these days and how it is transforming everything from the workforce to medicine, space exploration, and our lifestyles. AI is ...
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Considering that a new process can make a chip smaller, give it a clock speed boost, and make it more efficient, all without making any major changes to design or architecture, it's obvious why processes are so important. However, other factors like packaging (such as chiplets or tiles or...
In this four part series, Jason Andrews details the importance of co-verification of both hardware and software in embedded system design and provides details on the various ways to achieve this. Part 1: Determining what and how to verify. The process of embedded system design generally starts ...
Advanced semiconductor packaging uses multiple technologies to more efficiently combine IC chips in a package. A good place to start understanding advanced packaging is to look at its components and the various advanced packaging technologies that semiconductor foundries use. Components Chiplet: An ...