The Windows Mobile part of WiMo communicates with the wheels and sensors via Bluetooth. Humorously, Brian chose this connection style because he was worried about accidentally ruining his phone if he tried to solder wires to it. All the better, because now you can lift this code and us...
Is your solder mask larger than the component pad? Have you considered any possible mechanical assembly problems using a 3D model of the assembly? To help you with this, we created the PCB design checklist. This checklist can aid you in your own design work. Alongside our PCB design guidelin...
As well as creating strong electrical joints solder can also be removed using a desoldering tool. Solder is a metal alloy used to create strong permanent bonds; such as copper joining in circuit boards and copper pipe joints. It can also be supplied in two different types and diameters, lead...
In recent years, flip-chip technology has been increasingly adopted in consumer electronics and high-performance products. During flip-chip packaging, lead-free solder paste can be used for substrate bumping, modules, and board level connections, etc. What kind of lead-free solder paste should be...
Since it’s hard to solder to a liquid, a cathode counter-electrode is needed to complete the circuit through the sintered tantalum anode slug, and the design of this counter-electrode is one of the differentiators among different lines of wet tantalum devices. Modern devices use hermetically ...
if your mini plug is broken, you can either replace it with a new one or repair it. to repair it, you need to cut off the damaged part of the cable, strip the wires, and solder them back to a new mini plug connector. however, it's recommended to replace it if it's severely ...
The Windows Mobile part of WiMo communicates with the wheels and sensors via Bluetooth. Humorously, Brian chose this connection style because he was worried about accidentally ruining his phone if he tried to solder wires to it. All the better, because now you can lift this code and use it ...
The extremely small size of the device presents unique production challenges in regard to: board and pad design, board fabrication, stencil design, solder paste selection, stencil printing placement process, and the reflow process, pushing the limit of current practices. This will create many ...
You can then use reflow ovens or infrared lamps to produce this high heat—solder individualized solder joints with a hot air pencil. The Reflow Soldering Process Once the solder paste is applied, place the components on the board. The board is put through a tunnel with controlled heat to ...
norm, solder mask expansion can create small solder mask slivers that will be leftover on the surface layer. At some point, the minimum allowable solder mask sliver and the required solder mask expansion become competitive design rules; you might not be able to satisfy both rules simultaneously....