Wet clean清洗效果的好坏对IC工艺和性能有重大影响。清洁溶液处理不当会严重污染环境,并且大量的清洗循环将消耗大量的化学品和去离子水。稀释化学品法,IMEC法,干法清洗以及干洗和湿洗的组合都有助于减少各种化学品和去离子水的使用。人们仍在研究更有效的清洗技术,例如在面对制程更小、集成度更高的工艺时,清洗与兆声波
WET工艺介绍 WET工艺介绍 2 3 ICProcessing WaferIn WetCleaning(Pre-treatment)Diffusion CVD PVD Lithography Etching Doping ResistRemoval WaferOut WetCleaning(Post-treatment)4 WetProcess 1.FEOLpost-ashclean 35% -typicalSPM.-trendistointegrateresiststripingandcleaning.2.Pre-diffusionclean 30% -RCAclean ...
WET工艺介绍 下载积分: 2000 内容提示: 1 资料仅供参考,不当之处,请联系改正。 Purpose of Wet Cleaning Process Through to a series of processes to make the wafers free from particles, organic contaminations, metal contamination, surface microroughness and native oxide using some kinds of chemi...
WET工艺介绍.ppt,WET Process Introduction;Purpose of Wet Cleaning Process;Purpose of Wet Cleaning Process;Wet Cleaning (Pre-treatment);Wet Process;Chemicals Involved;Wet bench ; Purpose of Pre-clean is to remove the last unwanted oxide layer and prepare s
WET工艺介绍 星级: 63 页 Wet Etch设备及工艺介绍 星级: 30 页 第5章 Wet工艺 星级: 17 页 第5章 Wet工艺 星级: 20 页 第5章 wet工艺 星级: 20 页 WET工艺设备简介 星级: 18 页 第5章Wet工艺设计 星级: 25 页 工艺介绍 星级: 18 页 工艺介绍 星级: 11 页 工艺介绍 星级: 172 ...
WET工艺介绍 PurposeofWetCleaningProcess ▪Throughtoaseriesofprocessestomakethewafersfreefromparticles,organiccontaminations,metalcontamination,surfacemicroroughnessandnativeoxideusingsomekindsofchemicalsincludingDIW.2 PurposeofWetCleaningProcess ➢ForEtchingprocess•Oxideremove.•Nitrideremove.•Photoresist&polymer...
6 Wetbench 7 8 Pre-diffusionclean-RCAclean PurposeofPre-cleanistoremovethelastunwantedoxide layerandpreparesurfacefreeofmetalliccontaminantsandgoodPCfornextoxidation.H2O:HF(100:1)23oCH2ORinseH2O:H2O2:NH4OH(50:2:1)30oC H2ORinseRoomTemp H2O:H2O2:HCl(50:1:1)30oC H2ORinseRoomTemp ...
WET工艺介绍相关知识.ppt,unique id: 086465 Documentum\SMIC-IP(Aug2001)(Scn).ppt Mechanism: Si3N4 + 6H2O --- 3SiO2 + 4NH3 (H3PO4 as catalyst) ER A/min Si Conc. (ppm) Particle (#/ml,@0.2um) SiN SiO2 Particle Nitride Remove When the Silicon content is v
WET Process Introduction 2 Purpose of Wet Cleaning Process Through to a series of processes to make the wafers free from particles, organic contaminations, metal contamination, surface microroughness and native oxide using some kinds of chemicals including DIW. 3 Purpose of Wet Cleaning Process...