1. This series of transverse thinning grinding machine is a fully automatic precision grinding equipment. The workpiece is rotated in the opposite direction by the vacuum suction cup or electromagnetic suction cup, and the grinding wheel swings back and forth. The grinding ...
Fangda Equipment′s Wafer Grinding Machines and Precision Single-Axis Thinning Machines Are Suitable for Various Generations of Semiconductor Optical Component M US$20,000.00-100,000.00 / Piece Fangda Factory′s Fully Automatic Double-Sided Grinding and Polishing Machine Is a...
Fully automatic wafer thinning machineMainly used for automatic back grinding of 4'-8", 10-12" silicon wafers, double grinding head design, disc type slewing mechanism, station switching without waiting time.Product documentation download 产品规格(中文) 产品规格(英文) ...
Advanced semi-automatic wafer thinning film tearing machineSemi-automatic wafer thinning film tearing machine Wafer Robot Wafer Aligne UV Irradiator Wafer Support System STK-5150 Semi Automatic Wafer Detaper More SINTAIKE SEMICONDUCTOR EQUIPMENT(SHANGHAI) CO., LTD. ...
Customers’ wafers shall be fed into sputtering machine for metal deposits according to given metal types and thicknesses after IQC; subject the deposited wafer to metal etching after defining the metal via photo aligner with the customer-specified mask pattern and photolithography machine; perform OQC...
Semiconductor wafer grinding or back-thinning of advanced materials such as SiC, GaAs, Sapphire, Si, GaN, AlN, and InP.
1. The basic situation of the acceptance of ultra-precision wafer thinning machine Since the company launched the Versatile-GP300 mass production machine of a new generation of 12-inch ultra-precision wafer thinning machine in 2023, the company has actively promoted the introduction of clients, whi...
Wafer Back Thinning The substrate material on the back side of a completed wafer is thinned to remove a certain thickness to achieve a surface roughness of nanometer to atomic level. CMP Technology Flattening of wafer metal surfaces and polymer heterogeneous structures during processing using chemical...
Wafer Backgrindis the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as'wafer thinning.'Wafer backgrinding has not always been necessary, but the drive to make packages thinner and thinner has made it indispensable.Most ...
For picking up the ultra thin dies, we found the best tool design rule and some machine condition. In picking up the ultra thin dies, the amount of the overhang of the die to the width of the slider confirmed 0.3mm was the best. The peel property of the chip edge was improved by ...