Grip Ring can be used in semiconductor and LED chip, consisted of inner and outer ring. Grip Ring able to fix wafer to let it expand, provide variety of specs for customer to choose. Wafer size:6inch、7inch、8inch Hoop Ring Shipper Product would be more stable and accurate after test s...
產品應用 2.1 半導體產業 • 晶圓搬運 2.2 LED產業 • 藍寶石基板搬運 • Grip Ring (膠環)搬運 2.3 面板產業(小型面板,小型太陽能板) • 面板搬運 3C03TC01-1702 3. RW Series 3.1 選型表 RW -S-T Z400 R135 - Ata-F-M-T 晶圓機械手臂 - 手臂型式 - 固定型式 Z 軸行程 手臂長度 - 選配...
SolutionsIt is the manner which locks in the grip ring to which split manner of the wafer splits the wafer where reforming formation for percentage stopping/deciding was formed, is formed from the inner ring and the outer ring. First, the dicing frame the wafer lamp foot with the dicing ...
We offer various wafer expanders, each of which can be selected according to requirements, such as a manual system, a 12-inch motor-driven expander, and an expander with an auto-cut function. After expansion, the grip ring (automatic pinching of the inner ring and outer ring) holds the ...
Grip Ring MagazinesModel UH114 Series: (UH114, UH114-8, UH114-12) UH114-8 with Adapter Ring option shown [Back To Top] Ultron Systems' Model UH114 & UH115 Series Mounters set the benchmark for both control and versatility. For dicing/sawing applications, uniform adhesive plastic film lam...
The 200mm BHWS WaferShipper™ is designed to be compatible with most automated wafer packing, unpacking, and sorting equipment. Our unique, patent pending moveable wall design secures the wafers as the cover is closed. The edge-grip support “hugs” the wafers, limiting wafer movement and redu...
AMAT 0190-08245-REFU?RB WET ROBOT, EDGE GRIP CAPABLE, NON COPPER AMAT 0200-20348 COVER RING 6" B101 PROCESSES 8.87" OD AMAT 0010-08580 ASSY AMAT, DIW INLET AMAT 9240-02334ITL FOCUS/LENS/PART?ITION KIT Q2 ENI PL-2HFN-1-TR GENERATOR ...
GN1068-GRP6 Semtech Corporation跨阻抗放大器 quarter-wafer on grip ring GN1068-GRP6 10000 SemtechCorporation -- ￥11.1309元1~99 个 ￥9.8536元100~999 个 ￥9.4865元>=1000 个 深圳有信半导体有限公司 1年 -- 立即询价 查看电话 QQ联系 ...
6. The wafer polishing apparatus of claim 3 wherein said wafers include edges and said first and said second robotic end effectors grip said wafer edges to acquire said wafers. 7. The wafer polishing apparatus of claim 1 wherein said linear array of secondary modules includes a metrology mod...
A ring chuck that holds a wafer with a vacuum uses a vacuum trough that contacts the entire outer edge of the wafer. The chuck has a base having a top surface equal to or slightly smaller than a wafer to be tested with vacuum channels in the base. The base provides the mechanism to ...