Molecular beam epitaxy CuInS 2 layers were grown on Si single crystals of different orientation. The stoichiometry was varied between 0.5 and 1.5 for the nominal Cu/In ratio and the film thickness was limited to 150 nm. Composition analysis was done by in situ photoelectron spectroscopy (PES),...
To calculate the ρparticles a load of 1000 g for 10 min. was applied on a cube container filled with TiC particles. They found that ρparticles was 3.86 g/cm3 whereas the density of solid TiC particles (ρsolid) is 4.93 g/cm3. The volume fraction of reservoirs to incorporate TiC ...
Solid Specific heat Sprue SSORCG solver Start of fill STL file Stop pin Streak mark-color Streak mark-dark Streak mark-glass fiber Streak mark-white Stroke Sub-gate Suck back Surface Switchover Tensile strength Tessellation Thermal conductivity Thermal degradation Thick and chunky Tooling noise Transdu...
The PC-DMIS software was utilized for operation of the CMM. 4.1 Experiment setup For the experimental tests, we have used a cuboid object with the following nominal dimensions (the true values are unknown): length 210 mm, width 140 mm, and height 120 mm. The test object is shown ...
Since C16 is referenced to the source of Q1, the top of C16 rises above the 12V supply rail as Q1 turns on, forcing the gate of Q1 Since the input voltage is high relative to the output, the nominal duty factor of the high-side switch is small (in this case approximately 31%). ...
When high-level audio signals are involved, the lower VCR and TCR of thin film resistors become critical to achieving ultra-low distortion performance. This design, however, only deals with line-level signals with nominal amplitude of 1.228 VRMS. At this signal level, thick film resistors are ...
but as user one shall always test all entries, we cannot blame COMSOL anyhow it's up to us users to check everything (I just got caught on some material properties, with a T and P dependence, I didn't check the domain of T, I was outside nominal range, hence I lost 1/2 a day...
Four rows of solid vias (four vias per row, 0.3302 mm or 13 mils diameter) should be equally spaced underneath the thermal land. The vias should connect to a solid copper plane, either on an internal layer or on the bottom layer of the PCB. The vias must be solid vias, not thermal ...
Are attenuators suitable for solid-state amps? Generally, attenuators aren't necessary for solid-state amps. The appeal of attenuators comes from their ability to allow power tube distortion at lower volumes, which isn't relevant to solid-state designs. Solid-state amps typically sound consistent ...
Spacing of each layer 120mm Nominal pressure 160 T Appearance size 1700 x 4900, the height influenced by the layer numbers Detailed Photos Company Profile Founded in 1999, Zhejiang Henghui Machinery Co., Ltd. is the backbone enterprise of polyurethane equipment ...