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Export Citation: Click for automatic bibliography generation Assignee: UTAC Thai Limited Primary Class: 257/673 Other Classes: 257/E21.505, 257/E23.031, 438/109, 438/123, 257/E21.499 International Classes: H01L23/495;H01L21/50;H01L21/58 ...
Publication Date: 09/07/2010 Filing Date: 10/06/2008 Export Citation: Click for automatic bibliography generation Assignee: UTAC Thai Limited (Bangkok, TH) Primary Class: 438/123 Other Classes: 257/E21.499, 257/E21.502, 257/E21.503, 257/E21.504, 257/E21.505, 257/E21.506, 438/106, 438/...
Publication Date: 02/05/2013 Filing Date: 12/03/2010 Export Citation: Click for automatic bibliography generation Assignee: UTAC Thai Limited (Bangkok, TH) Primary Class: 257/666 Other Classes: 438/123 International Classes: H01L21/00;H01L23/495 ...
A process for forming land grid array semiconductor packages includes a leadframe that is supported by a substrate comprising mold compound. In some embodiments, at least one die is electrically coupled to the leadframe by bondwires. The package comprises a second mold compound to act as an en...
13. A method of fabricating a semiconductor package comprising: etching a through pattern in a metal thereby forming a die attach pad, a set of contact leads having a first set of contact pads surrounding the die attach pad and at least one auxiliary support member positioned between the die...