Microfluidic chips provide a unique opportunity to study the FRS. The application of microfluidic chips in the FRS began in the 1990s. At the earliest time, the birth of the first test-tube baby in Oldham, England, marked the beginning of ART in 1978 [93]. Since then, scientists have bee...
1b) with diameter of 8 mm and a depth of 35 mm is then attached to the borehole with epoxy resin adhesives. That means that there is an open-hole section with depth of 10 mm at the bottom of borehole. Before fracturing experiments, the basic mechanical properties are measured by ...
The mechanical tie method used for confining the concrete sample using the RPET strips differs from other external reinforcement such as a fiber-reinforced polymer (FRP) that uses epoxy resin to bond the FRP to the contact surface that is often expensive and intricate. The RPET bottle strips wer...
PROBLEM TO BE SOLVED: To provide an electroless platable highly heat resistant epoxy resin composition which shows excellent heat resistance and enables roughening treatment by means of a prior art, an insulation material for buildup using it and a build-up wiring plate.;SOLUTION: An epoxy resin...
The present invention relates to an epoxy resin compound, and more particularly, to an epoxy resin compound used for an insulating layer of a radiant heat circuit board. 2. Discussion of Related Art A circuit board, which includes a circuit pattern in an electric insulating board, is a board...
Finally, the surface of the PEC device without the overlayer was covered with an epoxy resin. Because the as-fabricated polyacrylamide cryogel on the slide glass had low optical transmittance, which is not suitable for photoelectrochemical (PEC) applications, we added glycerol as an anti-freezing ...
The category “Other polymers” groups the polymers present in lower percentages (polystyrene - PS, acrylic/acrylates polymers, polyurethane/polyether-urethane - PU, ethylene-propylene-diene-monomer - EPDM, polyvinyl acetate - PVAC, ethylene vinyl acetate - EVA, epoxy resin, phenoxy resin, ...
An epoxy resin composition for semiconductor encapsulation in producing surface mount lead-less thin semiconductor devices. The epoxy resin composition for surface mount lead-less s
An epoxy resin composition for encapsulating a semiconductor device comprising as essential components (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; and (D) a hollow inorganic fi
methacrylate, polyester, polysulfone, polyphenylene oxide, polybutadiene, poly(N-vinylcarbazole), hydrocarbon resin, ketone resin, phenoxy resin, polyamide, ethyl cellulose, vinyl acetate, ABS resin, polyurethane, melamine resin, unsaturated polyester resin, alkyd resin, epoxy resin, silicone resin, etc...