Production begins on copper-clad laminates and phenolic-paper laminates 1963 Production begins on copper-clad “epoxy resin based” laminates 1985 Isola acquires ADI, establishing a presence in the US 1992 Isola adds high-performance, high-Tg laminate materials ...
comprising (A) a silicon-containing, phosphorus-modified epoxy resin, (B) a multifunctional epoxy resin, (C) a mixed curing agent of an amine curing agent and a phenolic curing agent and (D) a metal hydrate inorganic flame retardant, and a prepreg and copper-clad laminate using the same....
constantly met customer needs and promoted the development of copper clad laminate to green and environmental protection,at the same time,the company has successively developed a series of products such as lead-free, halogen-free, high-speed and high-frequency and IC packaging base materials, especi...
Copper clad laminate, multilayer printed circuit board and their processing methodHitoshi YokonoHaruki YokonoMasahiro MikamoRyouichi NarushimaTakuya IidaYasuhiro Endo
The positive film resist product is used to prepare an electronic circuit by laminating the resist product to flexible copper clad circuit material. The polyethylene film is readily stripped from the laminate leaving the resist layer bonded to the copper surface. The laminate is covered with a circ...
FIG. 4 illustrates a flexible sheet 20 of insulating material to which the control windings have been applied by conventional printed circuit techniques. By way of example, a laminate with a mylar substrate which is copper clad on both sides and on which the control windings have been formed ...
Conformable metal-clad laminate: Olyphant Jr, M. (Minnesota Mining and Manufacturing Company, St Paul, MN, USA) US Pat 4 451 527 (29 May 1984)doi:10.1016/0010-4361(85)90496-3ELSEVIERComposites
COPPER FOIL FOR FLEXIBLE PRINTED WIRING BOARD, AND COPPER CLAD LAMINATE, FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC DEVICE USING THE SAMEPROBLEM TO BE SOLVED: To provide a copper foil for flexible printed wiring board excellent in etching property.BANDO SHINSUKE...
THERMOSETTING RESIN COMPOSITION FOR HIGH FREQUENCY WITH LOW DIELECTRIC LOSS PROPERTIES, AND PREPREG AND COPPER-CLAD LAMINATE USING SAMEThe present invention relates to a non-epoxy thermosetting resin composition for high frequency, and a prepreg and a printed circuit board containing the same. The non...
Cyanite composition and copper-clad laminate using the compositionYasuhiro EndoYoichi UedaToshiaki HayashiMitsuhiro ShibataShuichi KanagawaShinichiro KitayamaHisashi Watabu