please choose another country or region. Visit China website See all countries and regions Jan 24, 2024 Fujifilm Starts Full-Scale Operation of its Production Facility for Basic Material Used in Semiconductor Manufacturing Process Jan 15, 2024 ...
Our 28nm yield progress for poly-SiON & gate-last, High-K Metal Gate products has continued to improve, which will drive significant production ramp during the fourth quarter. This progress will help attract multiple waves of new customers and products to s...
We evaluated the productivity of bioenergy cropping systems (switchgrass [Panicum virgatum L., var. Cave-In-Rock], miscanthus [Miscanthus × giganteus, 'Illinois clone'], hybrid poplar [Populus nigra × P. maximowiczii A. Henry 'NM6'], native grasses [five species], early succ...
Certified Polysomnographic Technologist 4 days ago Wheat Ridge Job Description: The RST/RPSGT/RRT is accountable for performing and coordinating and scoring physiologic studies of sleep and sleep-related disorders. The incumbent provides care to patients via technology, therapeutic interventions, and coor...
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DeLuca NM, Angrish M, Wilkins A, Thayer K, Cohen Hubal EA (2021) Human exposure pathways to poly- and perfluoroalkyl substances (PFAS) from indoor media: a systematic review protocol. Environ Int 146:106308. https://doi.org/10.1016/j.envint.2020.106308 Article CAS Google Scholar DeNicola ...
ArticleCASPubMedGoogle Scholar Gutiérrez JM, Tsai WC, Pla D, Solano G, Lomonte B, Sanz L, Angulo Y, Calvete JJ. Preclinical assessment of a polyspecific antivenom against the venoms ofCerrophidion sasai,Porthidium nasutumandPorthidium ophryomegas: insights from combined antivenomics and neutr...
“Laminated, sacrificial-poly MEMS technology in standard CMOS,” Sensors and Actuators, Vol. 85 (2000), p. 346-355. The manufacturing process can include metallization as an etch-resistant mask to define the microstructures. The microstructural layers of the cantilever sensor device can be ...
More particularly, the present invention is related to an improved method of fabricating contact holes, via holes or openings on a semiconductor wafer, which is suited for semiconductor processes beyond 65 nm or 45 nm. 2. Description of the Prior Art The trend to micro-miniaturization, or the...
The thiol group of the N-terminal cysteine can be used for the formation of a "thioether" bond with haloacetyl-modified amino acid or a maleimide-derivatized α- or ε-NH2 group of a lysine residue that is attached to the N-terminus of a branched poly-lysyl core molecule (e.g., K2 ...