The outermost metallization layer comprises at least one bonding pad which contains aluminum and is electrically connected to the interconnect layer, and at least one interconnection runner. An under bump metallization (UBM) layer is arranged over the bonding pad, and a solder bump is arranged over...
UNDER BONDING PAD PATHWAY FOR REPLACING INTERCONNE 专利名称：UNDER BONDING PAD PATHWAY FOR REPLACING INTERCONNECT LAYER 发明人：ARCHER VANCE D III,ヴァンス デー．アーチャー サード,AYUKAWA MICHAEL C,マイケル シー．アユカワ,BACHMAN MARK A,マーク エー．バッチマン,CHESIRE DANIEL P,ダニエル...
The present invention develops a bond pad interconnect in an integrated circuit device, by forming an aluminum pad; bonding a metal layer (such as copper (... TT Doan,ME Tuttle - US 被引量: 184发表: 1995年 加载更多研究点推荐 UNDER BONDING PAD PATHWAY semiconductor device INTERCONNECT LAYER ...
high power setting and temperature may contribute to under-bonding.In a number of bonding experiments at different power setting and temperature setting,vibration velocity at the tip of transducer and its driving voltage,current were monitored,then their bonding strength was obtained.Driving power and ...
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Li, H. N-Heteroaromatic Acid Adlayer Structures under Hydrogen Bonding Influent: A Comprehensice UHV-STM/XPS/RAIRS Study. Ph.D. Dissertation, Univeristy of Maryland: College Park, MD, USA, 2007.N-heteroaromatic Acid Adlayer Structures Under Hydrogen Bonding Influence: AComprehensive UHV-STM/XPS...
Sabzevari B, Ramazanzadeh BA, Moazzami SM, Sharifi A. Microleakage under Orthodontic Metal Brackets Bonded with Three Different Bonding Techniques with/without Thermocycling. JDMT 2013; 2(1): 21-28.Sabzevari B, Ramazanzadeh BA, Moazzami SM, et al. Microleakage under Orthodontic Metal Brackets...
Moreover, the dynamic evolution of the life of the pavement structure under different bonding conditions was comprehensively explored. The results show that the bonding conditions had different effects on pavement surface deflection, shear strain, flexural-tensile strain, and maximum vertical compressive ...
When bonding methods that are in literature are simulated under UL and PGF cases, SV and HD values exceed the limits. When the optimized MSSB method is used, HD and SV do not exceed the limits. Therefore, the optimized MSSB is suggested to prevent CT faults for the unbalanced cases....