In the case NAM beam-N2, the finite element model has 90 dimensions. However, to analyze the stabilities and bifurcations of the periodic solutions, we need to reduce the dimensions of the whole model. We adopted the post-processed Galerkin algorithm in the frequency domain to reduce the dimen...
摘要: PROBLEM TO BE SOLVED: To provide an element for high-frequency that can operate even at an ultra-high-frequency region of several tens of GHz by preventing signal loss due to a silicon substrate that is generated at the ultra-high-frequency region....
The effect of reduced bulk magma density, as is caused by the presence of bubbles, would lowerReestimates by an amount equal to the fractional bubble concentration. The reduced density effect of bubbly magma would however be readily offset by the flows having greater thickness. For example a fl...
During the packaging processes, thermal stresses arise from the mismatch in coefficient of thermal expansion between the chip and the substrate, which can be directly coupled into the Cu/low-k interconnect structure to drive interfacial delamination. In this paper, finite-element method is used to ...
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This is determined by element resolved energy dispersive x-ray spectroscopy and three dimensional tomographic reconstruction. 展开 关键词: Magnetic tunnel junctions Current density Transmission electron microscopy Tantalum Electrical breakdown DOI: 10.1063/1.3272268 被引量: 14 ...
The associated algorithms are implemented into a Finite Element code and a procedure for the realization of the discretization is proposed. A uniaxial tensile test and a three-point bending test are computationally evaluated. Supported by simulations, the effect of the number of surface grains over ...
In spite of its many attributes such as nativity to silicon, low interfacial defect density, high melting point, large energy gap, high resistivity, and go... ML Green,TW Sorsch,GL Timp,... - 《Microelectronic Engineering》 被引量: 63发表: 1999年 Constant Current Stress Breakdown in Ultra...
et al. Silicon photonics integrated circuits: a manufacturing platform for high density, low power optical I/O’s. Opt. Express 23, 9369 (2015). Article ADS CAS PubMed Google Scholar Moss, D. J., Morandotti, R., Gaeta, A. L. & Lipson, M. New CMOS-compatible platforms based on ...
In this approach, the low Sn concentration enables improved defect engineering and the tensile strain delivers a low density of states at the valence band edge, which is the light hole band. We observe ultra-low-threshold continuous-wave and pulsed lasing at temperatures up to 70 K and 100...