视能带对其情况不同,半导体异质结被分为三类:type-I, type-II, 和 type-III,其能带图如图1[1]: ▲图1 The three types of semiconductor heterojunctions organized by band alignment. 半导体能带对齐有重要意义。比如,对于电子器件来说,常用的为 type-I band alignment, 要求 CBO/VBO 大于 1eV 才能更有效的...
semiconductor 1 with the terminal 5 connected to the PN junction, and the semiconductor element of which the n-type semiconductor 1 and the p-type semiconductor 2 are connected to the PN junction is PN joined An external energy (static electricity, noise, radio wave, wave) is captured as ...
deplete semiconductor 耗尽型半导体 magnetic semiconductor 磁性半导体 相似单词 semiconductor n. 半导体 P semiconductor 空穴导电型半导体 type n. 1.类型;种类 2.典型人物;典型,模范,模样 3.某种类型的人 4.铅字,活字 5.活字的宽度、字体或字号等 6.于…类型的;具有…特征的 7.(印刷或打印的)文字,字...
Tags: smtsmt solversmtsolversurface mountingSurface-mount technologytype 1 smttype 2 smttype 3 smttypes of smttypes of surface mountingSantosh Das Santosh, founder of this Electronics Tutorial Website, is an Electronics Geek, Blogger and Young Entrepreneur. He possesses vast experience in the field...
The P-type semiconductor can be defined as, once the trivalent impurity atoms such as indium, gallium are added to an intrinsic semiconductor, and then it is known as a p-type semiconductor. In this semiconductor, the majority charge carriers are holes whereas minority charge carriers are electr...
Digital logic gates are the building blocks of digital electronics. N-type and P-type transistors are combined to create CMOS (Complementary Metal-Oxide-Semiconductor) logic gates. N-type transistors conduct when a logical "1" is applied, allowing current to flow from the power supply to the ...
1. Whenametalisbroughtintocontactwithann-typesemiconductor, electrons will flew from the semi-conductor to themetal. 使一块金属与n型半导体接触时,电子将从半导体流到金属。 2. Inelectronics,aninterfacebetweenaP-typeandN-typesemiconductormaterial; such an interfaceproducesadiodeeffect. ...
n-type semiconductor 英 [en taɪp ˌsemikənˈdʌktə(r)] 美 [en taɪp ˈsemikəndʌktər]网络 半导体; N型半导体; 型半导体; n-型半导体
A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads disposed to have tips thereof opposing the die pad; metal wires; and an encapsulation resin for encapsu...
The invention relates to a security and/or valuable document containing a security feature which has a semiconductor section that comprises at least one first semiconductor layer and one second semiconductor layer, said two layers being in contact with each other and forming a type II semiconductor ...