TSSOP-14 封装尺寸图 PLANE COMPLIANT TO JEDEC STANDARDS MO-153AB-10.10a 14-Lead Thin Shrink Small Outline Package [TSSOP](RU-14)Dimensions shown in millimeters
TSSOP-14 封装尺寸图 PLANE COMPLIANT TO JEDEC STANDARDS MO-153AB-10.10a 14-Lead Thin Shrink Small Outline Package [TSSOP](RU-14)Dimensions shown in millimeters
内容提示: 4.504.404.30148716.40BSCPIN 15.105.004.900.65BSCSEATINGPLANE0.150.050.300.191.20MAX1.051.000.800.200.098 0 0.750.600.45COMPLIANT TO JEDEC STANDARDS MO-153AB-1COPLANARITY0.10a14-Lead Thin Shrink Small Outline Package [TSSOP](RU-14)Dimensions shown in millimeters 文档格式:PDF | 页数:1 | ...
0.65 BSC SEATING PLANE 0.15 0.05 0.30 0.19 1.20 MAX 1.05 1.00 0.80 0.20 0.09 8� 0� 0.75 0.60 0.45 COMPLIANTTOJEDECSTANDARDSMO-153AB-1 COPLANARITY 0.10 a 14-LeadThinShrinkSmallOutlinePackage[TSSOP] (RU-14) Dimensionsshowninmillimeters...
微雪电子SSOP14 TSSOP14测试座简介 SSOP14 TSSOP14 IC引脚间距0.65mm 编程座 测试座用于SSOP14的IC芯片进行烧写、测试,IC体宽4.4mm 型号 OTS-14(28)-0.65-01 2019-12-17 14:02:39 Pads 封装尺寸 小白问题? 刚学习pcb半个月,今天用系统自带的电容封装时候,封装0402,发现他的尺寸跟实际元器件尺寸对不上04...
MM74HCT74物理尺寸英寸(毫米),除非另有说明(续)14引脚超薄紧缩小型封装( TSSOP ),M74HCT74MTC PDF技术资料1第7页,M74HCT74MTCPDF资料信息,采购M74HCT74MTC,就上51电子网。
贴片元件封装尺寸图 热度: 8 5 4 1 PIN1 0.65 BSC SEATING PLANE 0.15 0.05 0.30 0.19 1.20 MAX 0.20 0.09 8� 0� 6.40BSC 4.50 4.40 4.30 3.10 3.00 2.90 COPLANARITY 0.10 0.75 0.60 0.45 COMPLIANTTOJEDECSTANDARDSMO-153AA a8-LeadThinShrinkSmallOutlinePackage[TSSOP] ...
物理尺寸英寸(毫米),除非另有说明TSSOP封装订单号LM4836MTNS包装数MTC28的TSSO,LM4836MTE PDF技术资料1第14页,LM4836MTEPDF资料信息,采购LM4836MTE,就上51电子网。
TSSOP-14 封装尺寸图 PLANE COMPLIANT TO JEDEC STANDARDS MO-153AB-10.10a 14-Lead Thin Shrink Small Outline Package [TSSOP](RU-14)Dimensions shown in millimeters