TSOP-I(Type I):也称为Type I封装,引脚在两侧排列,常见的引脚间距为0.5毫米。该封装广泛应用于存储器芯片,如闪存和SRAM等。 TSOP-II(Type II):也称为Type II封装,引脚在四周排列,通常具有更高的引脚密度。它主要用于集成电路和微控制器等应用,提供了更大的引脚数量和更高的集成度。 TSOP-III(Type III):Ty...
TSOP-32(Type-II) 2021+ ￥7.2000元10~99 个 ￥6.7000元100~999 个 ￥6.4500元>=1000 个 深圳市创芯联盈电子有限公司 6年 查看下载 立即询价 查看电话 QQ联系 FM28V100-TGTR CYPRESS/赛普拉斯 存储IC TSOP-32 2021+ 电子元器件 FM28V100-TGTR ...
This study presents a novel leadframe design with inner lead downset to eliminate the warpage phenomena for lead-on-chip (LOC) Thin Small Outline Package (TSOP) type II unbalanced (1:3) package with 0.18渭m SDRAM chip. By using this design, mold cavity in original unbalanced upper and ...
There are two types of TSOP's. The Type I TSOP has its leads protruding from the shorter edges of the package. The Type II TSOP has its leads protruding from the longer edges of the package. A Type 1 TSOP (left) and a Type 2 TSOP (right) VSOP - Very Small Outline Package The Ve...
This study presents a novel leadframe design with inner lead downset to eliminate the warpage phenomena for lead-on-chip (LOC) Thin Small Outline Package (TSOP) type II unbalanced (1:3) package with 0.18μm SDRAM chip. By using this design, mold cavity in original unbalanced upper and ...
ISSISRAM 64 x 16 Bit TSOP-44 (Type II), IS61LV6416-10TL, ISSI型号:IS61LV6416-10TL仓库库存编号:300-55-895 搜索 ISSISRAM 64 x 16 Bit TSOP-44 (Type II), IS61LV6416-10TLI, ISSI型号:IS61LV6416-10TLI仓库库存编号:300-55-896 搜索 www.szcwdz.cn 查看更多相关产品 参考...
Mounting TypeSurface Mount Package / Case54-TSOP (0.400", 10.16mm Width) Product StatusObsolete Clock Frequency133 MHz Memory InterfaceLVTTL Voltage - Supply3V ~ 3.6V Base Product NumberK4S510432D Memory Organization128M x 4 DigiKey ProgrammableNot Verified ...
型号: HYB25D512800CE-6 品牌: Qimonda 封装: 66-TSOP II 批次: - 数据手册: 描述: IC DRAM 512MBIT PAR 66TSOP II 购买数量: - + 立即购买 加入购物车 库存: 1719 最小起订量: 1 最小递增量: 1 数量 单价 1 6.783 请发送询价,我们将立即回复。 加入询价列表 产品信息 参数信息 用户指南 Mfr...
SRAM Type Asynchronous SRAM Memory Configuration 256K x 16bit No. of Pins 44Pins Supply Voltage Max 3.6V Clock Frequency Max - Operating Temperature Min -40°C Product Range - SVHC No SVHC (21-Jan-2025) Memory Density 4Mbit IC Case / Package TSOP-II Supply Volta...
Packages therefore are changing form the leadframe TSOP type 2 to faster CSPs such as fine pitch BGA (FBGA) and chip on substrate BGA (COSBGA). This paper is focused the COSBGA package [3,4]. In this paper, the packages electrical model have been established and performs signal ...