赛灵思公司宣布其与台积公司(TSMC)已经就7nm工艺和3DIC技术开展合作,共同打造其下一代All Programmable FPGA,MPSoC和3DIC.该技术代表着两家公司在先进工艺和CoWoS3D堆叠技术领域连续第四代携手合作,同时也将成为台积公司的第四代FinFET技术.双方合作将为赛灵思带来在多节点扩展的优势,并进一步延续其在28nm,20nm和16nm...
TSMC plans to change the batteries of all uninterruptible power systems in its plant into lithium iron phosphate batteries
Ansys and TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chipsKey...
Samsung Electronics and TSMC that are looking to implement ultra-microfabrication processes are expected to be engaged in a fierce competition in order to be the first company to purchase such systems. It is reported that TSMC, which has been aggressive recently in improving its production capacity ...
IEEE TRANSACTIONS ON SYSTEMS MAN & CYBERNETICS, PART A 1 Keeping the Resident in the Loop: Adapting the Smart Home to the User Advancements in supporting fields have increased the likelihood that smart-home technologies will become part of our everyday environments. However, many o... P Rashid...
SANTA CLARA, Calif., June 2, 2014—Memoir Systems Inc., today announced availability of its Renaissance soft memory IP cores for TSMC’s 16nm FinFET (16FF) designs and that it has six customer design wins with a few of them nearing tape out on this leading edge process node. In additio...
2020年2月一篇期刊论文被IEEE Transactions on Systmes, Man, and Cybernetics: Systems (IEEE TSMC)接收 来源: 田春伟/ 西北工业大学 1090 0 0 2021-04-01 20:49:32 2021-04-01 2020年2月一篇期刊论文被IEEE Transactions on Systmes, Man, and Cybernetics: Systems (IEEE TSMC)接收。该期刊录用率只有10...
Loring Wirbel
Ansys and TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chipsKey...
Ansys and TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chipsKey...