They are accelerating investment in R&D to $5.47B this year. The advanced technology roadmap is really split into two streams, the high end for premium mobile, data center, AI, and ADAS/autonomy (that's the top row in the diagram above). The lower row is mainstream for more price-sensi...
Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time. This article is the second of three that attempts to summarize the highlights of the presentations. This article focuses on the TSMC advanced packaging technology roadmap, as described by...
N3AE or “Auto Early” enables automotive applications on advanced chip manufacturing process technology. It offers automotive process design kits (PDKs) based on N3E and will be available in 2023. The fully automotive-qualified N3AE process will be unveiled in 2025. ...
This year, TSMC's customers that need a leading-edge fabrication process will use the company's N4 technology, which belongs to the N5 family (along with N5, N5P, N4P, and N4X). Essentially, this means that an N5 node will remain TSMC's most advanced offering for three consecuti...
Fig. 2 – Semiconductor Supply Chain, Center for Security and Emerging Technology, 2021 [1] TSMC is the largest and most advanced semiconductor foundry in the world, commanding over 50% of the market share. Known for its cutting-edge technology, TSMC leads in advanced process nodes (e.g.,...
the Board approved capital appropriations of approximately US$15,479.95 million for purposes including: 1) Fab construction, and installation of fab facility systems; 2) Installation of advanced technology capacity, as well as 2025 R&D capital investments and sustaining capital expenditures; 3) 2025 ca...
2025 to See Advanced Packaging Developments Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology. Technologies & Applications 2025-01-02 - Brian Dipert Tech Forecast for 2025 Read on for our intrepid engineer's latest set of ...
the Board approvedcapital appropriations of approximately US$15,479.95 million for purposes including: 1)Fab construction, and installation of fab facility systems; 2) Installation of advanced technology capacity, as well as 2025 R&D capital investments and sustaining capital expenditures; 3) 2025 capita...
1. To meet long-term capacity plans based on market demand forecasts and technology development roadmap, the Board approved capital appropriations of approximately US$17,356.20 million for purposes including: 1) Installation and upgrade of advanced technology capacity; 2) Installation and upgrade of ...
3. To meet long-term capacity plans based on market demand forecasts and TSMC’s technology development roadmap, the Board approved capital appropriations of approximately US$29,615.47 million for purposes including: 1) Installation and upgrade of advanced technology capacity; 2) Installation and upgr...