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In the datasheet, the rise and fall times of general-purpose general-purpose logic ICs are specified in the operating ranges in which their functional operation is guaranteed. Use general-purpose logic ICs within the operating ranges to...
10. The semiconductor device of claim 9, wherein a bending strength of the semiconductor sealing resin composition after solidification is 74 MPa or more. 11. The semiconductor device of claim 9, wherein an adhesion imparting agent is added to the semiconductor sealing composition to improve adhes...
Outer leads are buried in a package. At least the contact portions of the outer leads which are connected to a circuit board are exposed from the package and the exposed portions make the same flat su