FREE Technical Support Exclusive to Farnell Customers Home Cooling & Thermal Management Heat Sinks Natural Convection Heat Sinks Print Page Heat Sink, TO-126, TO-220, TO-247, 31.15 mm, 19.4 mm, 30.15 mm Image is for illustrative purposes only. Please refer to product d...
TV-4G [HEATSINK TO-126 BLACK] 深圳市松高微科技有限公司 6年 月均发货速度: 暂无记录 广东 深圳市福田区 ¥255.23 回收工厂库存 电子料IC TPS62095RGTR 优势销售 TI/德州仪器 全系 深圳皓晟达文化科技有限公司 1年 月均发货速度: 暂无记录 广东 深圳市福田区 ¥0.16 3DU13003 三极管...
1.Fasten the device to the heatsink before soldering the leads.2.Avoid stress to the leads.3.Keep mounting tool(e.g.screwdriver)clear of the plastic body.Mounting methods CLIP MOUNTING (TO126 AND SOT82)Mounting with a spring clip gives:a)A good thermal contact under the crystal area,and ...
comprising a housing, an outer lens, a thermally conductive plastic situated in operative relationship with the outer lens and a heating element for heating the thermally conductive plastic, wherein when the heating element heats the thermally conductive plastic, heat is directed towards the outer ...
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interrupts the current path; a circuit board on which the semiconductor element is mounted, a control circuit that turns on and off the semiconductor element to control energization to the motor being assembled to the circuit board; and a heat sink for dissipating heat from the semiconductor ...
POWER MODULE AND METHOD FOR CONNECTING POWER MODULE TO PRINTED CIRCUIT BOARD AND HEAT SINKPROBLEM TO BE SOLVED: To provide a power module that is connectable to a printed circuit board and a heat sink without reducing the area of the printed circuit board.JANOS NAVIREC...
CONSTITUTION:A land 1 is formed on the side of a soldering face on the rear of a board 4; a regulator or a power transistor which has been inserted into the board is pierced through a hole 38 in a heat sink, and is fixed temporarily by using a tapping screw 5 plated with a solder...
To the base wherePROBLEM TO BE SOLVED: To provide a tower-type heat sink excellent in thermal characteristics as well as productivity.望月 正孝益子 耕一
A ceramic carrier for an integrated circuit includes a hermetic electrically insulating substrate 15 having an opening 18, a heat sink 12 attached to the bottom of the integrated circuit 10 and to the back of the substrate 15 to thereby position the integrated circuit 10 in the opening 18, ...