Thermal data Symbol Parameter Rthj-case Thermal resistance junction-case max Rthj-amb Thermal resistance junction-amb max Value 1.14 50 Unit V A A A W A mJ V/ns °C °C Unit °C/W °C/W DocID024392 Rev 2 3/13 Electrical characteristics 2 Electrical characteristics STW19NM60N (TCASE...
20% lower thermal resistance Rth(jh)and improved by ~15% heat dissipation capability of TO-247PLUS vs TO-247 Reach higher design flexibility and higher system performance with 1200 V TO-247PLUS 4pin! TRENCHSTOP™ 5 in TO-247 4pin Kelvin Emitter Package ...
• Maximum Thermal Transfer Maximum surface area per unit volume, efficient cooling fins & consistent mounting force reduces thermal resistance. • Maximum Repeatability Constant spring force over repeated assembly/disassembly. • Maximum Reliability Resilient spring action locks electronic compo...
In addition, the Schottky diode in the TO-247-2 package incorporates .XT interconnection technology, which significantly reduces thermal resistance and impedance, thereby enhancing heat management. Humidity robustness has been validated through HV-H3TRB reliability testing. The diodes exhibit neither revers...
Table 2. Thermal data Symbol Parameter RthJC Thermal resistance, junction-to-case RthJA Thermal resistance, junction-to-ambient Value ±25 60 38 240 446 100 1000 100 -55 to 150 Unit V A A W V/ns A/μs V/ns °C °C Value 0.28 50 Unit °C/W °C/W Table 3. Avalanche ...
The loss of thermal contact area and increase of thermal resistance due to warpage were characterized to determine the most effective approach to enlarge the thermal contact area. The new approach is to design-in an appropriate feature on the package to optimize the thermal contact area. The pre...
台湾光颉TO-247封装100W功率电阻TR100系列选型手册
Package TypeTO-247 Power Rating70 W Power Rating, Test Condition@ +25°C Resistance7.5 Ohms Resistance, Thermal, Junction to Case1.79 °C⁄W SeriesTEH70 Series Special FeaturesHeat Sink Temperature Coefficient±100 ppm/°C Temperature, Operating, Maximum150 °C ...
Package Size 36.00cm * 20.00cm * 24.00cm Package Gross Weight 8.000kg Product Description High Thermal Conductivity Mosfet TO220 TO247, TO264, TO3p Al2O3 Alumina Ceramic Pad Product Description Ceramic pad for Mosfet TO packaging is made of 95...
发热芯片真正发热的是内部的核,这个叫junction,board是芯片接触的PCB版 thermal resistance是热阻 合起来就是从芯片核到PCB之间的热阻，写成Rjb from