Amkor has qualified and is ramping production of the next generation Package on Package (PoP) technology called Thru Mold Via (TMV?). In order to prepare for high volume manufacturing of this new PoP package, Amkor undertook extensive development and evaluations of Surface Mount Technology (SMT)...
在莫斯科斯巴达克踢了六年球,其间经历了苏联解体的风波,却也让很多前苏联的球员有了出国踢球的机会,沙利莫夫就是这样被“小世界杯”意甲的球探看上了,而在福贾的表现也说明了,他确实有足够的能力在意甲立足。