Throwing Power and Covering Power in Electroplating Solutionsdoi:10.1080/00202967.1950.11869549de BruijnW.Taylor & FrancisTransactions of the Imf
1. A composition suitable for electrocoating an electrically conductive substrate in an aqueous medium using high voltages and characterized by exhibiting high throwing power and crosslinkable by oxygen promoted radical graft polymerization comprising: ...
1. An aqueous electroplating solution comprising: at least one soluble copper salt, an electrolyte, at least one organic additive capable of modifying the charge transfer overpotential of said bath in an amount sufficient to shift said overpotential by at least 150 millivolts, said shift being ind...
4) dispersing power 分散能力 1. Nickel electroplating technology has being applied in variety fields, and this technology has been developed for hundreds of years, while there still exist such problems as poor lightness——the coating is gray and dull, low deposition rate and current efficiency,...
doi:10.1080/00202967.1976.11870372P. CsokánTaylor & FrancisTransactions of the IMFCsokan P.The effect of superimposed magnetic field with direct current on throwing power in electroplating. Transactions of the Institute of Metal Finishing . 1976...
The high throwing power (TP) value is one of the most important parameters for the Cu electroplating of through-holes in flexible printed circuit (FPC). It was found that an ultra-high TP value could be obtained using a specific suppressor, i.e., iodonitrotetrazolium chloride (INT) in ...
The throwing power of nickel electroplating baths was measured from the extent of plating penetration inside a tube by applying a new formula which relates the degree of penetration to the crevice dimensions and plating current. The effect of different factors such as pH value, anion or cation ...
A quality metric, called micro-throwing power, characterises the volume of Cu that can be deposited within a THV. In this paper, we analyse the influence of 1 卤 0.05 MHz megasonic (MS) assisted agitation applied to copper (Cu) electroplating baths on the micro-throwing ability of a ...
Ibrahim MA (2000) Improving the throwing power of acidic zinc sulfate electroplating baths. J Chem Technol Biotechnol 75:745–755. : 10.1002/1097-4660(200008)75:83.0.CO;2-5Magdy, I. (2000) Improving the throwing power of acidic zinc sulfate electroplating baths J. Chem...
The paper deals with the microthrowing power of an electroplating bath (copper and tin-lead) with low metal concentration. A new method for the evaluation of microthrowing power is described. Experiments were made to obtain the dependence of microthrowing power on agitation rate and additive ...