Additional Information Supplementary information accompanies this paper at http://www.nature.com/srep Competing Interests: The authors declare no competing financial interests. How to cite this article: Liu, Interfaces. Sci. Rep. 7, 43886; Y. et doi: al. Thermal Conductance of 10.1038/srep43886 ...
Wrote and commented the paper: W.S., C.Z., F.W., K.K. Additional Information Competing financial interests: The authors declare no competing financial interests. How to cite this article: Song, W. F. et al. Use of a novel smart heating sleeping bag to improve wearers' local thermal...
Abstract: This paper presents the thermal analysis of a novel laser sintering machine for additive manufacturing of continuous carbon fibre-reinforced polymer parts. The core element of this machine is a fibre integration unit with a heated fibre nozzle. With the help of an additional heat source,...
6. Conclusions The paper briefly reviews the application of functionally graded coatings obtained by thermal spray technology. Initially, the conventional thermal spray techniques such as atmospheric plasma spraying (APS) and high velocity oxy-fuel (HVOF) were described. Then new processes such as ...
This paper presents a field investigation on the influence of transient thermal comfort changes between the indoor and outdoor spaces (i.e., air temperature (Ta), solar radiation (SR), relative humidity (RH), wind speed (WS), and the thermal comfort indices of Universal Ther- mal Index (...
It is presented in Section 2.2 of the paper. contact Liquid line: ID4.95/OD6.35 × 300 (made Results: The startup of LHP with the second evaporator was conductance, by stainless-steel) shorter in time and more stable than one with the traditional LHP thermal Forced convective air cooling ...
Conclusions This paper proposes a thermal balancing method for monolithic power ICs. The method yields the exact chip temperature and heat distribution, which can thus be changed to improve the lifetime of the power MOS in the test chip. According to the readings of a real-time LDMOS junction...