[2] Martin Maerz, Paul Nance, Thermal Modeling of Power Electronic Systems, Application Note, April 2000http://www.iisb.fraunhofer.de/en/arb_geb/powersys_pub.htm Revision History: Tutorial Version 1.0 First release 本文章原文链接(英文English)www.plexim.com/sites/default/files/tutorials_categ...
This chapter will introduce some basic techniques for modeling thermal circuits using lumped equivalent circuits that can be used in power electronic circuits. The fundamental thermal circuit concepts are introduced, and the methods by which these can be used in a practical manner by the power ...
Finally, the accuracy of the proposed thermal model is verified by FEM simulations and experimental results show a good agreement. 展开 关键词: Insulated gate bipolar transistors Finite element analysis Boundary conditions Heating systems Mathematical model Transient analysis Integrated circuit modeling ...
Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems An original, fully analytical, spectral domain decomposition approach is presented for the time-dependent thermal modeling of complex nonlinear (3-D) elect... ...
Predict, analyze, and optimize your system’s power and thermal behavior. Intel® Docea™ solutions enable modeling and simulation of the power consumption and thermal behavior of electronic systems from an architectural perspective. The solutions are used to secure specifications, optimize power beh...
Numerous materials and interfaces are utilized in these systems, often displaying highly anisotropic behavior. Thermal management devices such as fans and heat sinks also result in unique challenges in system level thermal modeling. While a number of advances in computational modeling have been made in...
Thermal modeling and design of 3D integrated circuits 3D interconnect technology has attracted significant interest in the recent past as a means for enabling faster and more efficient integrated circuits (ICs... A Jain,RE Jones,R Chatterjee,... - Conference on Thermal & Thermomechanical Phenomena...
Comparison of overhead and underfloor air delivery systems in a data center environment using CFD modeling Then, using methods developed by Sharma, Bash, and Chandrakant (Dimensionless Parameters for Evaluation of Thermal Design and Performance of Large-Scale Data Centers, AIAA, 2002), the performance...
The passive system normally utilizes PCM [10], [11], [12], heat pipe [13], or air convection that consumes minimum power. Hybrid systems implement both advantages of passive and active systems. Air-cooled systems usually are less expensive and more complicated than other BTMS configurations. ...
The automatic, self-powered operation of this materials-based design provides a fail-safe complement to standard electronic safety systems. Incorporation into the base encapsulating structure of a device adds this important function with negligible increases of cost, thickness, weight, size or mechanical...