空气处理系统可能很复杂,有许多离散的部件来管理气流并将空气引导到需要冷却的热点。 University of Illinois研究人员已经证明了一种新型的空气喷射冷却器,它克服了以前喷射冷却系统的障碍。利用增材制造,研究人员在单个部件中创建了一个空气喷射冷却系统,该系统可以将高速空气引导到多个电子热点上。研究人员用坚固的聚合物...
一、辐射换热 热设计工程师通常不关心电子元件和外壳的辐射换热。 影响辐射换热的三个因素是物体与其周围环境之间的温差、物体与其周围的表面特征以及物体对周围环境的状态。 首先,温度差是设备外壳和外部机箱之间的差值,或者外部机箱和房间墙壁之间的差值。由于辐射热传递是基于这种温差的,当组件与其周围环境之间的差值变...
电子设备热设计40第一章41ThermalDesignofElectronicEquipment 系统标签: thermalequipmentelectronicheat电子设备design HibbelerR.C.“Force-SystemResultantsandEquilibrium” ThermalDesignofElectronicEquipment. Ed.RalphRemsburg BocaRaton:CRCPressLLC,2001 ©2001byCRCPRESSLLC 1 IntroductiontoThermal DesignofElectronic Equi...
电子设备热设计(Thermal Design of Electronic Equipment)-15 半导体器件射流冲击冷却系统 电子设备热设计(Thermal Design of Electronic Equipment)-16 环路微通道散热器 电子设备热设计(Thermal Design of Electronic Equipment)-17 热电冷却器TEC INTRODUCTION:均热板 均热板(Vapor chamber),也称为平面热管散热器,是具...
Thermal Design of Electronic Equipment 作者:Remsburg, Ralph 出版年:2000-9 页数:400 定价:$ 178.48 ISBN:9780849300820 豆瓣评分 评价人数不足 评价: 写笔记 写书评 加入购书单 分享到 + 加入购书单
C. "Force-System Resultants and Equilibrium" Thermal Design of Electronic Equipment. Ed. Ralph Remsburg Boca Raton: CRC Press LLC, 2001 1 Introduction to Thermal Design of Electronic Equipment 1.1 INTRODUCTION TO THE MODES OF HEAT TRANSFER IN ELECTRONIC EQUIPMENT Electronic devices produce heat as ...
Whitaker THERMAL DESIGN OF ELECTRONIC EQUIPMENT Ralph Remsburg THE RESOURCE HANDBOOK OF ELECTRONICS Jerry C. Whitaker MICROELECTRONICS Jerry C. Whitaker SEMICONDUCTOR DEVICES AND CIRCUITS Jerry C. Whitaker SIGNAL MEASUREMENT, ANALYSIS, AND TESTING Jerry C. Whitaker F O R T H C O M I N G T I ...
Electronic installation hot design, value heat transfer theory, in computation hydrodynamics, project non-linearized theory and method, 翻译结果3复制译文编辑译文朗读译文返回顶部 Thermal design of electronic equipment, numerical heat transfer, computational fluid dynamics, engineering of Nonlinear Theory and ...
In this paper, the thermal design of a kind of electronic equipment based on parametric simulation has been researched. The research which uses the ANSYS Workbench as the platform has taken the fin number and the fin thickness as the design variables, the fin weight as the constraint condition...
【预订】Thermal Design of Electronic Equipment 美国库房发货,通常付款后3-5周到货! 作者:Ralph Remsburg出版社:CRC Press Inc出版时间:1988年08月 手机专享价 ¥ 当当价 降价通知 ¥2561 配送至 北京 至 北京市东城区 服务 由“中国进口图书旗舰店”发货,并提供售后服务。