From theoretical considerations the thermal properties can be tailored by a simple variation of the volume fraction of the reinforcement. An additional parameter of importance in the copper-carbon system is the thermal contact resistance (TCR). By a variation of the TCR the whole range between an...
Thermal Resistance, RthermalX10-4 (m2.K/W) Contact Pressure 100 kN/m2 10,000 kN/m2 Stainless Steel 6-25 0.7-4.0 Copper 1-10 0.1-0.5 Magnesium 1.5-3.5 0.2-0.4 Aluminum 1.5-5.0 0.2-0.4 Contents Electrical Analogy of Heat Conduction Thermal Contact Resistance - Example Defining Th...
The wettability and interface thermal resistance of copper/graphite system with an addition of chromium In the present work, the wettability and interface thermal resistance (ITR) of copper/graphite (Cu/Gr) system with an addition of chromium (Cr) was studied... GL Liu - 《Materials Chemistry ...
equations and assuming that thermal contact resistance was negligible14, we find that the thermal conductance and thermal conductivity of NW B are GNW = 1.522 × 10−9 W/K and kNW(GNW × L/A) = 0.037 W/m·K, respectively. The measured thermal conductivity, kNW,...
3.Thecontact resistancebetween granular adsorbent (zeolite/polyaniline composite) and copper surface,and between shaped adsorbent and copper surface has been tested.测试了颗粒吸附剂(沸石/聚苯胺复合物)、成型吸附剂与铜表面之间的接触热阻以及导热胶对吸附剂与铜表面之间的接触热阻的影响。
where ρD(3.52 g/cm3, 30) and ρM(8.96 g/cm3,30) is theoretical density of diamond and copper matrix, respectively. In addition, VD(50 vt.%) and VM(50 vt.%) is the volume fraction of diamond particles and copper matrix, respectively. Therefore, the theoretical density of ...
Copper/diamond composites were produced by the powder metallurgical method. It is known from former experiments, that there is a very weak bonding between ... T.,Schubert,and,... - 《Scripta Materialia》 被引量: 280发表: 2008年 Factors controlling the type and morphology of Cu-containing pha...
The contact resistance tests focus on measuring the variation of contact resistance with applied force over the range from 90 N to 161 N for gold-plated OFHC copper samples with surface roughness in the range of 1 to 2 micrometer. Results from these tests will provide insight into the ...
The influence of mechanical adhesion of copper coatings on carbon surfaces on the interfacial thermal contact resistance The weak mechanical and thermal interface in Copper based Metal Matrix Composites (MMCs) reinforced by carbon fibers is the background of this research stu... E Neubauer,G Korb,...
摘要: This work reports the development of a measurement technique for the estimation of thermal contact conductance at a polymer (Nylon)-metal(Copper) two dimensional interface having an annular contact...DOI: 10.1007/s00231-018-2410-7 年份: 2018 ...