copperalloythermal diffusivitymoldA setup is created to determine the main thermotechnical characteristics of copper alloys. At temperatures below 400°C, Cu–Fe alloys are found to have the thermal conductivity and the thermal diffusivity that are lower than those of pure copper by a factor of ...
The thermal conductivity and electric resistivity of two pure copper materials and nine commercial copper alloys were measured in the approximate range 1300-1500 K. The thermal conductivity was measured by the guarded axial-rod longitudinal-heat-flow technique. The samples were contained in thin-...
The thermal conductivity of copper is the measure of its ability to conduct heat, it means the transfer of heat from one body to another, the thermal conductivity of a substance, k, is an intensive property(a property of a material that does not depend on the amount or shape of the mate...
Experimental/ copperporous materialsthermal conductivity of solids/ porous Cu compactsporous metalsthermal conductivityflame or plasma spraying of powders/ A6670 Nonelectronic thermal conduction and heat-pulse propagation in nonmetallic solids A8140 Treatment of materials and its effects on microstructures and...
A further difference between the microstructure of neutron irradiated copper and nickel is apparent at damage levels greater than 0.1 dpa. The interstitial ... NM Ghoniem,D Walgraef,SJ Zinkle - Journal of Computer-Aided Materials Design 被引量: 68发表: 2001年 The thermal conductivity of fast ne...
Measurements are reported for the first time of a complete set of thermal conductivity and electrical resistivity data, both transverse and longitudinal, in fields up to 12.5 T between 3 and 15 K for a polycrystalline sample of copper (residual resistivity ratio equal to 108). The transverse res...
It was found that 0.05 % concentration of copper oxide nanoparticle with 5% concentration of oleic acid surfactant resulting stable dispersion in kerosene. The thermal conductivity enhancement of about 16% was observed of 0.05% CuO nanofluid with surfactant vis-a-vis those of Kerosene. It was also...
Kim K T,Jung W J,Choi C S.Influence of alloying elements on thermal conductivity and high temperature strength of copper based alloys. Journal of Materials Science . 2001KIM K T, JUNG W J, CHOI C S. Influence of alloying elements on thermal conductivity and high temperature strength of ...
Thermal conductivity of copper powder filled polyamide composites are investigated experimentally in the range of filler content 0-30% by volume for particle shape of short fibers and 0-60% by volume for particle shapes of plates and spheres. The thermal conductivity of polymer composites is measure...
thermal conductivityThe effect of the addition of n-layer graphene on the thermal conductivity of copper samples sintered at high pressure and temperature was studied. It was shown that the addition of graphene Gn (4) to copper powder in an amount of 0.2–0.4 wt % allows an increase in the...