A linear spin wave theory with a single Heisenberg interaction on the honeycomb lattice, including both transverse and longitudinal channels of the neutron response, reproduces all of the key features in the spectrum. In particular, we identify a Van Hove singularity, a clearly observable sharp ...
Lungs were immediately excised en bloc with the heart and intrabronchial cannulas and perfused with cold OCT:PBS (3:1) (Optimal Cutting compound, Company). Lungs were then placed in cassettes with OCT on a dry ice platform and frozen at −80 °C. Lung blocks 70-µm thick were ...
Hgh1 has a curved tubular shape with dimensions of 40 × 50 × 80 Å (Figures 6A and 6B). The α-helical solenoid protein comprises four imperfect armadillo repeats, followed by two non-canonical 3-helix repeats. A pair of helices caps the N-terminal end of the solenoid. The helix ...
Smart alloy gained popularity after Buehler and his coworkers in 1962 exhibited SME in a titanium-nickel (TiNi) alloy [127]. After the discovery of SMAs, extensive progress has been performed in the applications of these multifunctional alloys and the fundamental understanding of the shape memory ...
Important results have also been obtained for the description of charge transport in devices made both of elemental and compound semiconductors, in cases where charge confinement is present and the carrier flow is two- or one-dimensional. Keywords: Maximum Entropy Principle; charge transport; ...
2,2,6,6–tetramethylpiperidine–1–oxyl radical (TEMPO) is a piperidine nitroxide radical compound and TEMPO oxidation is a composite oxidation system including TEMPO, which is only weakly oxidizing. There are three main TEMPO co-oxidation systems: TEMPO-electrochemical oxidation, TEMPO-enzyme oxidat...
ancestry with the compound eyes [31,32]. In contrast, hemimetabolous insects, such as crickets, hatch from the egg already equipped with well-developed compound eyes and ocelli. Each ocellus has a single lens consisting of transparent cuticle. A clear zone is located between it and the ...
The future directions to improve the reliability of the solder bumping is discussed in terms of controlling the intermetallic compound at the TSV/solder bumping interface. 2. Through-Si-via 2.1. TSV Formation and DRIE Technology For forming TSV, the deep reactive ion etching (DRIE) process is ...
A III-V compound semiconductor device comprises the use of a compound semiconductor of groups III-V of the periodic table with a polycrystalline structure of an average grain size of 0.6 μm or larger.
What is the origin of the oxygen we breathe, the hydrogen and oxygen (in form of water H2O) in rivers and oceans, the carbon in all organic compounds, the