X-RAY / BONDTESTER RELIABILITY STUDY OF BGA DEVICES - IMPACT...
VoidingIPC-610J-STD-001AXIAutomated X-Ray InspectionX-ray technologyComputer TomographyThe impact of voiding on BGA/CSP joint reliability has been discussed actively during the last several years. IPC-610-A and J-STD-001 state that void...