Precision Etch & Form Photo Etched & Laser Cut Parts We use a photo etching process that allows us to create intricate and detailed pieces that can’t be made with other processes. For quick prototypes, check out our Innovation Center. ...
Phil Bedard,Accion Systems, Manufacturing and Supply Chain Do you need prototypes quickly? If so, please see our Innovation Center Innovation Center
“It’ll help the semiconductor industry continue the pace of innovation that we’ve all come to rely on, and it’ll improve the time to market for all kinds of chips in the future,” Vivek Singh, VP of Nvidia’s advanced technology group, explained during a press conference on Monday. ...
ASML has finally finished development of EUV (Extreme Ultra Violet) pellicles to be employed in manufacturing processes that use the most energetic frequency of visible light to etch semiconductors onto wafers. Pellicles have been used for decades in the industry, and they are basically ultra-thin ...
The competitive etch: Addressing the talent gap With investment in foundries and IDMs, the US is set to be a semiconductor powerhouse, but could lose ground for technical roles. CFO & Enterprise Value High Tech CFOs: Evolving into the future Sustainability Is your sustainability strategy lea...
On the technology side, leveraging data goes along with the journey to constantly update the embedded systems of agricultural equipment, said Julian Sanchez, director of John Deere’s Technology Innovation Center. John Deere, the world largest agricultural equipment supplier, has been on a quest over...
ASML, the maker of these EUV machines used to etch the pattern on silicon, has been the supplier of the Taiwanese company. TSMC has announced that they own an amazing 50% of all EUV machine installations. What is more important is the capacity that the company achieves with it. It is ...
(Those oxen in the cave drawingsbarelyresemble the real thing, by the way. Truth be told, you can’t really expect more of our ancestorswho didn’t even have a measly etch-a-sketch let alone a laser-beam based alarm system!)
(CNY 100.0M is ~$14.6M) in Series B funding led by Guofang Capital with participation from Eastern Bell Capital, GF Xinde Investment Management, Goldstone Investment, Lightspeed China Partners, Long Capital, Shanghai Lingang Innovation Center, Shenzhen Guozhong Venture Capital Management, and Sunic ...
We are the leader in MOCVD, MBE, Ion Beam, Wet Etch single wafer processing and other advanced thin film process technologies. Our high performance systems drive innovation in energy efficiency, consumer electronics and network storage and allow our customers to maximize productivity and achieve ...