Find out all of the information about the BE Semiconductor Industries N.V. product: flip-chip die bonder Datacon 8800 TC advanced . Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.
ASM 02-86589 03-28627-02 rev J Left Bonder CPU module ASM 03060811-06 CVJ-F729-1790 ASM 03-20140-01 rev L TS-38-31 ASM 03-20140-02 Rev L TS-38-80 ASM 03-20140-03 Rev L ASM 03-20140-04 Rev. L ASM 03-20140-05 Rev L ASM 03-20140-06 rev H-P1 R-INDEXER SI...
Kulicke & Soffa 4523 Manual Wedge Bonder 610234 GAL ELECTRIC TEB132100A 3 POLE CIRCUIT BREAKER 100A 240V ** HPI Pioneer Slim Cullet Chuck - CAT40-SK10-120 w/Warranty。 142A-3699-1300 Anritsu MP1763B-01-03 M30789 12.5 GHz Pulse Pattern Generator 触摸屏GT1685M-STBA Lot of ATC...
PROBLEM TO BE SOLVED: To provide a die bonder and a bonding method capable of subjecting wafers to grade treatment without removing the wafers, in a die bonder having a bonding head moving in a direction intersecting with a conveyance lane.SOLUTION: In a die bonder and a bonding method havi...
supporter of both sides; a Y-axis LM guide and a Y-axis rectilinear robot coupled to the horizontal supporter; and a laser head installed at the Y-... JH Jo,CG Cho 被引量: 0发表: 2019年 Job head unit to roll to the leveller and the bonder null SOLUTION: An operation head 4 is...
Machine vision for alignment and inspection in die bonder Machine vision is widely used in die bonders to provide perfect alignment between the wafer or leadframe and the die pickup tip during pick and place opera... S Kolloor,S Balamurugan - International Society for Optics and Photonics 被...